SLRS065F September   2013  – October 2026

PRODUCTION DATA  

1.   1
2. 1 Features
3. 2 Applications
4. 3 Description
5. 4 Pin Configuration and Functions
   1.     Pin Functions
   2. 4.1 External Components
6. 5 Specifications
   1. 5.1 Absolute Maximum Ratings
   2. 5.2 Handling Ratings
   3. 5.3 Recommended Operating Conditions
   4. 5.4 Thermal Information #GUID-BBF32D3F-EEEB-410C-B62D-3BA0A3DC7FD4/SLRS0651971
   5. 5.5 Electrical Characteristics
   6. 5.6 Timing Requirements
   7. 5.7 Typical Characteristics
7. 6 Detailed Description
   1. 6.1 Overview
   2. 6.2 Functional Block Diagram
   3. 6.3 Feature Description
      1. 6.3.1 Recommended Output Current
      2. 6.3.2 Daisy Chain Connection
      3. 6.3.3 22
      4. 6.3.4 Protection Circuits
         1. 6.3.4.1 Overcurrent Protection (OCP)
         2. 6.3.4.2 Open Load Detection (OL) - DRV8860 only
         3. 6.3.4.3 Thermal Shutdown (TSD)
         4. 6.3.4.4 Undervoltage Lockout (UVLO)
         5. 6.3.4.5 Digital Noise Filter
   4. 6.4 Device Functional Modes
      1. 6.4.1 Internal Registers
   5. 6.5 Programming
      1. 6.5.1 Serial Control Interface
         1. 6.5.1.1 Data Writing Waveform
         2. 6.5.1.2 Fault Register Reading Waveform
         3. 6.5.1.3 Special Command
            1. 6.5.1.3.1 Special command: Write Control Register
            2. 6.5.1.3.2 Special command: Read Control Register
            3. 6.5.1.3.3 Special command: Read Data Register
            4. 6.5.1.3.4 Special command: Fault Register Reset
            5. 6.5.1.3.5 Special command: PWM Start
         4. 6.5.1.4 Output Energizing and PWM Control
            1. 6.5.1.4.1 PWM Start Special Command Used
8. 7 Register Maps
   1. 7.1 Data Register
   2. 7.2 Fault Register
   3. 7.3 Control Register
9. 8 Application and Implementation
   1. 8.1 Application Information
   2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
         1. 8.2.2.1 Drive Current
      3. 8.2.3 Application Curves
   3.     Power Supply Recommendations
      1. 8.3.1 Power Supply and Logic Sequencing
   4. 8.3 Layout
      1. 8.3.1 Layout Guidelines
      2. 8.3.2 Layout Example
      3. 8.3.3 Thermal Consideration
         1. 8.3.3.1 Power Dissipation
         2. 8.3.3.2 Heatsinking
10. 9 Device and Documentation Support
    1. 9.1 Trademarks
       1. 9.1.1 Community Resources
11. 10Revision History
12. 11Mechanical, Packaging, and Orderable Information