SLYS023A December   2020  – May 2022 INA229

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements (SPI)
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Versatile High Voltage Measurement Capability
      2. 7.3.2 Internal Measurement and Calculation Engine
      3. 7.3.3 Low Bias Current
      4. 7.3.4 High-Precision Delta-Sigma ADC
        1. 7.3.4.1 Low Latency Digital Filter
        2. 7.3.4.2 Flexible Conversion Times and Averaging
      5. 7.3.5 Shunt Resistor Drift Compensation
      6. 7.3.6 Integrated Precision Oscillator
      7. 7.3.7 Multi-Alert Monitoring and Fault Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Power-On Reset
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 SPI Frame
    6. 7.6 Register Maps
      1. 7.6.1 INA229 Registers
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Device Measurement Range and Resolution
      2. 8.1.2 Current , Power, Energy, and Charge Calculations
      3. 8.1.3 ADC Output Data Rate and Noise Performance
      4. 8.1.4 Input Filtering Considerations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Select the Shunt Resistor
        2. 8.2.2.2 Configure the Device
        3. 8.2.2.3 Program the Shunt Calibration Register
        4. 8.2.2.4 Set Desired Fault Thresholds
        5. 8.2.2.5 Calculate Returned Values
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Input Filtering Considerations

As previously discussed, INA229 offers several options for noise filtering by allowing the user to select the conversion times and number of averages independently in the ADC_CONFIG register. The conversion times can be set independently for the shunt voltage and bus voltage measurements to allow added flexibility in monitoring of the power-supply bus.

The internal ADC has good inherent noise rejection; however, the transients that occur at or very close to the sampling rate harmonics can cause problems. Because these signals are at 1 MHz and higher, they can be managed by incorporating filtering at the input of the device. Filtering high frequency signals enables the use of low-value series resistors on the filter with negligible effects on measurement accuracy. For best results, filter using the lowest possible series resistance (typically 100 Ω or less) and a ceramic capacitor. Recommended values for this capacitor are between 0.1 µF and 1 µF. Figure 8-1 shows the device with a filter added at the input.

Overload conditions are another consideration for the device inputs. The device inputs are specified to tolerate ±40 V differential across the IN+ and IN– pins. A large differential scenario might be a short to ground on the load side of the shunt. This type of event can result in full power-supply voltage across the shunt (as long the power supply or energy storage capacitors support it). Removing a short to ground can result in inductive kickbacks that could exceed the 40-V differential or 85-V common-mode absolute maximum rating of the device. Inductive kickback voltages are best controlled by Zener-type transient-absorbing devices (commonly called transzorbs) combined with sufficient energy storage capacitance. See the Transient Robustness for Current Shunt Monitors reference design which describes a high-side current shunt monitor used to measure the voltage developed across a current-sensing resistor when current passes through it.

In applications that do not have large energy storage, electrolytic capacitors on one or both sides of the shunt, an input overstress condition may result from an excessive dV/dt of the voltage applied to the input. A hard physical short is the most likely cause of this event. This problem occurs because an excessive dV/dt can activate the ESD protection in the device in systems where large currents are available. Testing demonstrates that the addition of 10-Ω resistors in series with each input of the device sufficiently protects the inputs against this dV/dt failure up to the 40-V maximum differential voltage rating of the device. Selecting these resistors in the range noted has minimal effect on accuracy.

GUID-20201111-CA0I-WK5X-W9FC-TNNKFLVZNVKQ-low.gifFigure 8-1 Input Filtering

Do not use values greater than 100 ohms for RFILTER. Doing so will degrade gain error and increase non-linearity.