JAJSN53A February   2012  – December 2021 INA230

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Related Products
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements (I2C)
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Basic ADC Functions
      2. 8.3.2 Power Calculation
      3. 8.3.3 Alert Pin
    4. 8.4 Device Functional Modes
      1. 8.4.1 Averaging and Conversion Time Considerations
      2. 8.4.2 Filtering and Input Considerations
    5. 8.5 Programming
      1. 8.5.1 Programming the Calibration Register
      2. 8.5.2 Programming the INA230 Power Measurement Engine
        1. 8.5.2.1 Calibration Register and Scaling
      3. 8.5.3 Simple Current Shunt Monitor Usage (No Programming Necessary)
      4. 8.5.4 Default INA230 Settings
      5. 8.5.5 Bus Overview
        1. 8.5.5.1 Serial Bus Address
        2. 8.5.5.2 Serial Interface
      6. 8.5.6 Writing to and Reading From the I2C Serial Interface
        1. 8.5.6.1 High-Speed I2C Mode
      7. 8.5.7 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Configuration Register (00h, Read/Write)
      2. 8.6.2 AVG Bit Settings [11:9]
      3. 8.6.3 VBUS CT Bit Settings [8:6]
      4. 8.6.4 VSH CT Bit Settings [5:3]
      5. 8.6.5 Mode Settings [2:0]
      6. 8.6.6 Data Output Register
        1. 8.6.6.1 Shunt Voltage Register (01h, Read-Only)
        2. 8.6.6.2 Bus Voltage Register (02h, Read-Only) (1)
        3. 8.6.6.3 Power Register (03h, Read-Only)
        4. 8.6.6.4 Current Register (04h, Read-Only)
        5. 8.6.6.5 Calibration Register (05h, Read/Write)
        6. 8.6.6.6 Mask/Enable Register (06h, Read/Write)
        7. 8.6.6.7 Alert Limit Register (07h, Read/Write)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side Sensing Circuit Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision * (February 2012) to Revision A (December 2021)

  • 「ESD 定格」表、「推奨動作条件」表、「機能説明」セクション、「デバイスの機能モード」セクション、「アプリケーションと実装」セクション、「電源に関する推奨事項」セクション、「レイアウト」セクション、「デバイスおよびドキュメントのサポート」セクション、「メカニカル、パッケージ、および注文情報」セクションを追加Go
  • 文書全体にわたって表、図、相互参照の採番方法を更新Go
  • DGS (VSSOP) パッケージを追加Go
  • Increased common-mode voltage rangeGo
  • Improved common-mode rejection, offset, and gain error specifications Go