JAJSCV1B November   2016  – September 2018 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA.  

  1. 特長
  2. アプリケーション
  3. 概要
    1.     概略回路図
  4. 改訂履歴
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Rating
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 関連リンク
    3. 12.3 ドキュメントの更新通知を受け取る方法
    4. 12.4 コミュニティ・リソース
    5. 12.5 商標
    6. 12.6 静電気放電に関する注意事項
    7. 12.7 Glossary
  13. 13メカニカル、パッケージ、および注文情報

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • DBQ|16
  • DW|16
サーマルパッド・メカニカル・データ
発注情報

改訂履歴

Changes from A Revision (May 2018) to B Revision

  • Changed ドキュメント全体を通して、DIN認定番号および認定ステータスをGo
  • Changed DBQパッケージの絶縁定格を2500VRMSから3000VRMSGo
  • Moved the HBM and CDM values from the Features section to the ESD Ratings tableGo
  • Added VTEST to the conditions for the maximum transient isolation voltage parameter in the Insulation Specifications tableGo
  • Changed the value for the DBQ package from 3600 VPK to 4242 VPK throughout the documentGo
  • Changed the method b1 Vini condition for apparent charge in the Insulation Specifications tableGo
  • Switched the line colors for VCC at 2.5 V and VCC at 3.3 VGo
  • Switched the labels for VCC1 falling and VCC2 rising in the graph legend of Power Supply Undervoltage Threshold vs Free-Air TemperatureGo

Changes from * Revision (November 2016) to A Revision

  • Updated the Safety-Related Certifications tableGo
  • Changed the minimum CMTI from 40 to 85 in all Electrical Characteristics tables Go