JAJS782G june   1999  – march 2023 LM2576 , LM2576HV

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: 3.3 V
    6. 6.6  Electrical Characteristics: 5 V
    7. 6.7  Electrical Characteristics: 12 V
    8. 6.8  Electrical Characteristics: 15 V
    9. 6.9  Electrical Characteristics: Adjustable Output Voltage
    10. 6.10 Electrical Characteristics: All Output Voltage Versions
    11. 6.11 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Delayed Start-Up
      3. 7.3.3 Adjustable Output, Low-Ripple Power Supply
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 Current Limit
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1  Input Capacitor (CIN)
      2. 8.1.2  Inductor Selection
      3. 8.1.3  Inductor Ripple Current
      4. 8.1.4  Output Capacitor
      5. 8.1.5  Catch Diode
      6. 8.1.6  Output Voltage Ripple and Transients
      7. 8.1.7  Feedback Connection
      8. 8.1.8  ON /OFF INPUT
      9. 8.1.9  Inverting Regulator
      10. 8.1.10 Negative Boost Regulator
    2. 8.2 Typical Applications
      1. 8.2.1 Fixed Output Voltage Version
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection (L1)
          3. 8.2.1.2.3 Output Capacitor Selection (COUT)
          4. 8.2.1.2.4 Catch Diode Selection (D1)
          5. 8.2.1.2.5 Input Capacitor (CIN)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Adjusted Output Voltage Version
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Programming Output Voltage
          2. 8.2.2.2.2 Inductor Selection (L1)
          3. 8.2.2.2.3 Output Capacitor Selection (COUT)
          4. 8.2.2.2.4 Catch Diode Selection (D1)
          5. 8.2.2.2.5 Input Capacitor (CIN)
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Grounding
      4. 8.4.4 Heat Sink and Thermal Considerations
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
        1. 9.1.1.1 Definition of Terms
      2. 9.1.2 Development Support
        1. 9.1.2.1 Custom Design with WEBENCH® Tools
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 サポート・リソース
    4. 9.4 ドキュメントの更新通知を受け取る方法
    5. 9.5 Trademarks
    6. 9.6 静電気放電に関する注意事項
    7. 9.7 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • NDH|5
  • NEB|5
  • KTT|5
  • KC|5
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)(2)(3)LM2576, LM2576HVUNIT
KTT (TO-263)KC (TO-220)
5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance42.632.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance43.341.2°C/W
RθJBJunction-to-board thermal resistance22.417.6°C/W
ψJTJunction-to-top characterization parameter10.77.8°C/W
ψJBJunction-to-board characterization parameter21.317°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance0.40.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953 and the Using New Thermal Metrics applications report, SBVA025.
(2) The package thermal impedance is calculated in accordance with JESD 51-7
(3) Thermal Resistances were simulated on a 4-layer, JEDEC board.