JAJSEU2F August   2017  – November 2020 LMR33630

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 System Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Power-Good Flag Output
      2. 8.3.2 Enable and Start-up
      3. 8.3.3 Current Limit and Short Circuit
      4. 8.3.4 Undervoltage Lockout and Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Auto Mode
      2. 8.4.2 Dropout
      3. 8.4.3 Minimum Switch On-Time
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Custom Design With WEBENCH® Tools
        2. 9.2.2.2  Choosing the Switching Frequency
        3. 9.2.2.3  Setting the Output Voltage
        4. 9.2.2.4  Inductor Selection
        5. 9.2.2.5  Output Capacitor Selection
        6. 9.2.2.6  Input Capacitor Selection
        7. 9.2.2.7  CBOOT
        8. 9.2.2.8  VCC
        9. 9.2.2.9  CFF Selection
        10. 9.2.2.10 External UVLO
        11. 9.2.2.11 Maximum Ambient Temperature
      3. 9.2.3 Application Curves
    3. 9.3 What to Do and What Not to Do
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Ground and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • RNX|12
  • DDA|8
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from Revision E (May 2020) to Revision F (November 2020)

  • 「特長」に機能安全の箇条書き項目を追加Go
  • 文書全体にわたって表、図、相互参照の採番方法を更新Go
  • Added RNX pinout drawingGo
  • Added VQFN package drawingGo

Changes from Revision D (March 2019) to Revision E (May 2020)

  • TPSM53603 製品ページへのリンクを追加Go

Changes from Revision C (June 2018) to Revision D (March 2019)

  • Changed heading to device option Go
  • Changed Minimum peak current to reflect ATE data.Go
  • Changed zero cross to reflect ATE data.Go
  • Changed to new current limit equationGo
  • Added new de-rate curveGo

Changes from Revision B (April 2018) to Revision C (June 2018)

  • Changed heading to device option Go
  • Added graphs for Typical Switching Frequency in Dropout Mode Go

Changes from Revision A (February 2018) to Revision B (April 2018)

  • データシート全体にわたって WSON の情報を追加Go
  • Changed block diagram to fix drawing errorGo
  • Added RNX package drawings Go

Changes from Revision * (August 2017) to Revision A (February 2018)

  • 量産データのデータシートの初版Go