|Voltage at output pin||–0.3||(VDD + 0.5)||V|
|Input current at any pin(2)||–5||5||mA|
|Maximum junction temperature (TJMAX)||150||°C|
|Storage temperature Tstg||–65||150||°C|
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) When the input voltage (VI) at any pin exceeds power supplies (VI < GND or VI > V), the current at that pin should be limited to 5 mA.
(3) Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging