|RθJA||Junction-to-ambient thermal resistance (3)(4)||275||°C/W|
|RθJC(top)||Junction-to-case (top) thermal resistance||84||°C/W|
|RθJB||Junction-to-board thermal resistance||56||°C/W|
|ψJT||Junction-to-top characterization parameter||1.2||°C/W|
|ψJB||Junction-to-board characterization parameter||55||°C/W|(1)
For information on self-heating and thermal response time see section Section 8.4.1
(3) The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are included in the PCB, per JESD 51-5.
(4) Changes in output due to self-heating can be computed by multiplying the internal dissipation by the thermal resistance.