SLOS263X August   1999  – May 2020 LMV321 , LMV324 , LMV358

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions: LMV358
    2.     Pin Functions: LMV321
    3.     Pin Functions: LMV324
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321
    5. 6.5 Thermal Information: LMV324
    6. 6.6 Thermal Information: LMV358
    7. 6.7 Electrical Characteristics: VCC+ = 2.7 V
    8. 6.8 Electrical Characteristics: VCC+ = 5 V
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Unity-Gain Bandwidth
      3. 7.3.3 Slew Rate
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Amplifier Selection
        2. 8.1.2.2 Passive Component Selection
      3. 8.1.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ(パッケージ|ピン)
  • D|8
  • DGK|8
  • PW|8
  • DDU|8
サーマルパッド・メカニカル・データ
発注情報

Revision History

Changes from W Revision (October 2014) to X Revision

  • Deleted LMV324S mentions on the front page of the data sheetGo
  • Added end equipment links in Application sectionGo
  • Added recommended device notice for LMV321A, LMV358A, and LMV324AGo
  • Changed Device Information table to sort devices by channel count in ascending orderGo
  • Changed Pin Configuration and Functions section by dividing the Pin Functions table into separate tables per deviceGo
  • Deleted LMV324S pinout information Go
  • Changed HBM ESD voltage from 2500 V to 2000 VGo
  • Changed CDM ESD voltage from 1500 V to 1000 VGo
  • Deleted Shutdown voltage threshold for LMV324SGo
  • Changed Thermal Information section by dividing the Thermal Information table into separate tables per deviceGo
  • Changed Thermal Information for LMV321 Go
  • Deleted LMV324S Thermal Information Go
  • Changed Thermal Information for LMV324 Go
  • Changed Thermal Information for LMV358 Go
  • Deleted LMV324S test condition for supply current Go
  • Changed output short-circuit current for sourcing from 60 mA to 40 mA Go
  • Changed output short-circuit current for sinking from 160 mA to 40 mA Go
  • Deleted LMV324S test condition for supply current Go
  • Added assured by characterization table notes to output short-circuit current, output swing, and input bias current specifications Go
  • Changed Source Current Vs Output Voltage VCC=2.7V plot with Output Voltage vs Output Current (Claw) plot in Typical Characteristics sectionGo
  • Deleted plots Source Current Vs Output Voltage VCC= 5V, Sinking Current vs Output Voltage VCC=2.7V, Sinking Current vs Output Voltage VCC=5V, Short-Circuit Current vs Temperature in Typical Characteristics sectionGo
  • Changed Open-Loop Output Impedance Vs Frequency plot in Typical Characteristics sectionGo
  • Added Receiving Notification and Support Resources sections to the Device and Documentation Support sectionGo