SLOS263X August   1999  – May 2020 LMV321 , LMV324 , LMV358

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: LMV358
    2.     Pin Functions: LMV321
    3.     Pin Functions: LMV324
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: LMV321
    5. 6.5 Thermal Information: LMV324
    6. 6.6 Thermal Information: LMV358
    7. 6.7 Electrical Characteristics: VCC+ = 2.7 V
    8. 6.8 Electrical Characteristics: VCC+ = 5 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Unity-Gain Bandwidth
      3. 7.3.3 Slew Rate
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Amplifier Selection
        2. 8.1.2.2 Passive Component Selection
      3. 8.1.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Links
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • D|8
  • DGK|8
  • PW|8
  • DDU|8
サーマルパッド・メカニカル・データ
発注情報

6.6 Thermal Information: LMV358

THERMAL METRIC(1) LMV358 UNIT
D (SOIC) DGK (VSSOP) DDU (VSSOP) PW (TSSOP)
8 PINS 8 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 207.9 201.2 210 200.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.