JAJSO71 March   2022 LP8764-Q1

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 説明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1. 5.1 Digital Signal Descriptions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Internal Low Drop-Out Regulators (LDOVINT)
    6. 6.6  BUCK1, BUCK2, BUCK3, and BUCK4 Regulators
    7. 6.7  Reference Generator (REFOUT)
    8. 6.8  Monitoring Functions
    9. 6.9  Clocks, Oscillators, and DPLL
    10. 6.10 Thermal Monitoring and Shutdown
    11. 6.11 System Control Thresholds
    12. 6.12 Current Consumption
    13. 6.13 Digital Input Signal Parameters
    14. 6.14 Digital Output Signal Parameters
    15. 6.15 I/O Pullup and Pulldown Resistance
    16. 6.16 I2C Interface
    17. 6.17 Serial Peripheral Interface (SPI)
      1.      25
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1  Overview
    2. 8.2  Functional Block Diagram
    3. 8.3  Input Voltage Monitor
    4. 8.4  Device State Machine
      1. 8.4.1 Fixed Device Power FSM
        1. 8.4.1.1 Register Resets and EEPROM read at INIT state
      2. 8.4.2 Pre-Configurable Mission States
        1. 8.4.2.1 PFSM Commands
          1. 8.4.2.1.1  REG_WRITE_IMM Command
          2. 8.4.2.1.2  REG_WRITE_MASK_IMM Command
          3. 8.4.2.1.3  REG_WRITE_MASK_PAGE0_IMM Command
          4. 8.4.2.1.4  REG_WRITE_BIT_PAGE0_IMM Command
          5. 8.4.2.1.5  REG_WRITE_WIN_PAGE0_IMM Command
          6. 8.4.2.1.6  REG_WRITE_VOUT_IMM Command
          7. 8.4.2.1.7  REG_WRITE_VCTRL_IMM Command
          8. 8.4.2.1.8  REG_WRITE_MASK_SREG Command
          9. 8.4.2.1.9  SREG_READ_REG Command
          10. 8.4.2.1.10 SREG_WRITE_IMM Command
          11. 8.4.2.1.11 WAIT Command
          12. 8.4.2.1.12 DELAY_IMM Command
          13. 8.4.2.1.13 DELAY_SREG Command
          14. 8.4.2.1.14 TRIG_SET Command
          15. 8.4.2.1.15 TRIG_MASK Command
          16. 8.4.2.1.16 END Command
        2. 8.4.2.2 Configuration Memory Organization and Sequence Execution
        3. 8.4.2.3 Mission State Configuration
        4. 8.4.2.4 Pre-Configured Hardware Transitions
          1. 8.4.2.4.1 ON Requests
          2. 8.4.2.4.2 OFF Requests
            1. 8.4.2.4.2.1 NSLEEP1 and NSLEEP2 Functions
            2. 8.4.2.4.2.2 WKUP1 and WKUP2 Functions
      3. 8.4.3 Error Handling Operations
        1. 8.4.3.1 Power Rail Output Error
        2. 8.4.3.2 Boot BIST Error
        3. 8.4.3.3 Runtime BIST Error
        4. 8.4.3.4 Catastrophic Error
        5. 8.4.3.5 Watchdog (WDOG) Error
        6. 8.4.3.6 Error Signal Monitor (ESM) Error
        7. 8.4.3.7 Warnings
      4. 8.4.4 Device Start-up Timing
      5. 8.4.5 Power Sequences
      6. 8.4.6 First Supply Detection
    5. 8.5  Power Resources
      1. 8.5.1 Buck Regulators
        1. 8.5.1.1 BUCK Regulator Overview
        2. 8.5.1.2 Multi-Phase Operation and Phase-Adding or Shedding
        3. 8.5.1.3 Transition Between PWM and PFM Modes
        4. 8.5.1.4 Spread-Spectrum Mode
        5. 8.5.1.5 Adaptive Voltage Scaling (AVS) and Dynamic Voltage Scaling (DVS) Support
        6. 8.5.1.6 BUCK Output Voltage Setting
      2. 8.5.2 Sync Clock Functionality
      3. 8.5.3 Internal Low Dropout Regulator (LDOVINT)
    6. 8.6  Residual Voltage Checking
    7. 8.7  Output Voltage Monitor and PGOOD Generation
    8. 8.8  General-Purpose I/Os (GPIO Pins)
    9. 8.9  Thermal Monitoring
      1. 8.9.1 Thermal Warning Function
      2. 8.9.2 Thermal Shutdown
    10. 8.10 Interrupts
    11. 8.11 Control Interfaces
      1. 8.11.1 CRC Calculation for I2C and SPI Interface Protocols
      2. 8.11.2 I2C-Compatible Interface
        1. 8.11.2.1 Data Validity
        2. 8.11.2.2 Start and Stop Conditions
        3. 8.11.2.3 Transferring Data
        4. 8.11.2.4 Auto-Increment Feature
      3. 8.11.3 Serial Peripheral Interface (SPI)
    12. 8.12 Multi-PMIC Synchronization
      1. 8.12.1 SPMI Interface System Setup
      2. 8.12.2 Transmission Protocol and CRC
        1. 8.12.2.1 Operation with Transmission Errors
        2. 8.12.2.2 Transmitted Information
      3. 8.12.3 SPMI Target Device Communication to SPMI Controller Device
        1. 8.12.3.1 Incomplete Communication from SPMI Target Device to SPMI Controller Device
      4. 8.12.4 SPMI-BIST Overview
        1. 8.12.4.1 SPMI Bus during Boot BIST and RUNTIME BIST
        2. 8.12.4.2 Periodic Checking of the SPMI
        3. 8.12.4.3 SPMI Message Priorities
    13. 8.13 NVM Configurable Registers
      1. 8.13.1 Register Page Partitioning
      2. 8.13.2 CRC Protection for Configuration, Control, and Test Registers
      3. 8.13.3 CRC Protection for User Registers
      4. 8.13.4 Register Write Protection
        1. 8.13.4.1 ESM and WDOG Configuration Registers
        2. 8.13.4.2 User Registers
    14. 8.14 Watchdog (WD)
      1. 8.14.1 Watchdog Fail Counter and Status
      2. 8.14.2 Watchdog Start-Up and Configuration
      3. 8.14.3 MCU to Watchdog Synchronization
      4. 8.14.4 Watchdog Disable Function
      5. 8.14.5 Watchdog Sequence
      6. 8.14.6 Watchdog Trigger Mode
      7. 8.14.7 WatchDog Flow Chart and Timing Diagrams in Trigger Mode
      8.      121
      9. 8.14.8 Watchdog Question-Answer Mode
        1. 8.14.8.1 Watchdog Q&A Related Definitions
        2. 8.14.8.2 Question Generation
        3. 8.14.8.3 Answer Comparison
          1. 8.14.8.3.1 Sequence of the 2-bit Watchdog Answer Counter
          2. 8.14.8.3.2 Watchdog Sequence Events and Status Updates
          3. 8.14.8.3.3 Watchdog Q&A Sequence Scenarios
    15. 8.15 Error Signal Monitor (ESM)
      1. 8.15.1 ESM Error-Handling Procedure
      2. 8.15.2 Level Mode
      3.      132
      4. 8.15.3 PWM Mode
        1. 8.15.3.1 Good-Events and Bad-Events
        2. 8.15.3.2 ESM Error-Counter
          1. 8.15.3.2.1 ESM Start-Up in PWM Mode
        3. 8.15.3.3 ESM Flow Chart and Timing Diagrams in PWM Mode
        4.       138
    16. 8.16 Register Map
      1. 8.16.1 LP8764x_map Registers
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Buck Inductor Selection
        2. 9.2.1.2 Buck Input Capacitor Selection
        3. 9.2.1.3 Buck Output Capacitor Selection
        4. 9.2.1.4 LDO Output Capacitor Selection
        5. 9.2.1.5 VCCA Supply Filtering Components
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Voltage Scaling Precautions
      4. 9.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 サポート・リソース
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.16 I2C Interface

Over operating free-air temperature range (unless otherwise noted). Device supports standard mode (100 kHz), fast mode (400 kHz), and fast mode+ (1 MHz) when VIO is 3.3 V or 1.8 V, and high-speed mode (3.4 MHz) only when VIO is 1.8 V.
POS PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Electrical Characteristics
13.1 CB Capacitive load for SDA and SCL 400 pF
Timing Requirements
13.2a ƒSCL Serial clock frequency Standard mode 100 kHz
13.2b Fast mode 400
13.2c Fast mode+ 1 MHz
13.2d High-speed mode, Cb = 100 pF 3.4
13.2e High-speed mode, Cb = 400 pF 1.7
13.3a tLOW SCL low time Standard mode 4.7 µs
13.3b Fast mode 1.3
13.3c Fast mode+ 0.5
13.3d High-speed mode, Cb = 100 pF 160 ns
13.3e High-speed mode, Cb = 400 pF 320
13.4a tHIGH SCL high time Standard mode 4 µs
13.4b Fast mode 0.6
13.4c Fast mode+ 0.26
13.4d High-speed mode, Cb = 100 pF 60 ns
13.4e High-speed mode, Cb = 400 pF 120
13.5a tSU;DAT Data setup time Standard mode 250 ns
13.5b Fast mode 100
13.5c Fast mode+ 50
13.5d High-speed mode 10
13.6a tHD;DAT Data hold time Standard mode 10 3450 ns
13.6b Fast mode 10 900
13.6c Fast mode+ 10
13.6d High-speed mode, Cb = 100 pF 10 70 ns
13.6e High-speed mode, Cb = 400 pF 10 150
13.7a tSU;STA Setup time for a start or a REPEATED START condition Standard mode 4.7 µs
13.7b Fast mode 0.6
13.7c Fast mode+ 0.26
13.7d High-speed mode 160 ns
13.8a tHD;STA Hold time for a start or a REPEATED START condition Standard mode 4 µs
13.8b Fast mode 0.6
13.8c Fast mode+ 0.26
13.8d High-speed mode 160 ns
13.9a tBUF Bus free time between a STOP and START condition Standard mode 4.7 µs
13.9b Fast mode 1.3
13.9c Fast mode+ 0.5
13.10a tSU;STO Setup time for a STOP condition Standard mode 4 µs
13.10b Fast mode 0.6
13.10c Fast mode+ 0.26
13.10d High-speed mode 160 ns
13.11a trDA Rise time of SDA signal Standard mode 1000 ns
13.11b Fast mode 20 300
13.11c Fast mode+ 120
13.11d High-speed mode, Cb = 100 pF 10 80
13.11e High-speed mode, Cb = 400 pF 20 160
13.12a tfDA Fall time of SDA signal Standard mode 300 ns
13.12b Fast mode 6.5 300
13.12c Fast mode+ 6.5 120
13.12d High-speed mode, Cb = 100 pF 10 80
13.12e High-speed mode, Cb = 400 pF 13 160
13.13a trCL Rise time of SCL signal Standard mode 1000 ns
13.13b Fast mode 20 300
13.13c Fast mode+ 120
13.13d High-speed mode, Cb = 100 pF 10 40
13.13e High-speed mode, Cb = 400 pF 20 80
13.14a trCL1 Rise time of SCL signal after a repeated start condition and after an acknowledge bit High-speed mode, Cb = 100 pF 10 80 ns
13.14b High-speed mode, Cb = 400 pF 20 160
13.15a tfCL Fall time of SCL signal Standard mode 300 ns
13.15b Fast mode 6.5 300
13.15c Fast mode+ 6.5 120
13.15d High-speed mode, Cb = 100 pF 10 40
13.15e High-speed mode, Cb = 400 pF 20 80
13.16a tSP Pulse width of spike suppressed (SCL and SDA spikes that are less than the indicated width are suppressed) Standard mode, fast mode, and fast mode+ 50 ns
13.16b High-speed mode, Cb = 400 pf 10