JAJSMD4D December   2003  – March 2022 OPA1632

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: OPA1632D
    6. 6.6 Electrical Characteristics: OPA1632DGN
    7. 6.7 Typical Characteristics: OPA1632D
    8. 6.8 Typical Characteristics: OPA1632DGN
  7. Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Fully-Differential Amplifiers
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Function
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Common-Mode Voltage
        1. 8.1.1.1 Resistor Matching
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PowerPAD Design Considerations
      2. 10.1.2 Power Dissipation and Thermal Considerations
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Third-Party Products Disclaimer
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Export Control Notice
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Power Dissipation and Thermal Considerations

The OPA1632 does not have thermal shutdown protection. Take care to assure that the maximum junction temperature is not exceeded. Excessive junction temperature can degrade performance or cause permanent damage. For best performance and reliability, assure that the junction temperature does not exceed 125°C.

The thermal characteristics of the device are dictated by the package and the circuit board. Maximum power dissipation for a given package can be calculated using the following formula:

GUID-FD270A08-437F-457F-9F76-6FCFD40BD985-low.gif

where:

  • PDMax is the maximum power dissipation in the amplifier (W)
  • TMax is the absolute maximum junction temperature (°C)
  • TA is the ambient temperature (°C)
  • θJA = θJC + θCA
  • θJC is the thermal coefficient from the silicon junctions to the case (°C/W)
  • θCA is the thermal coefficient from the case to ambient air (°C/W)

For systems where heat dissipation is more critical, the OPA1632 is offered in an MSOP-8 with PowerPAD. The thermal coefficient for the MSOP PowerPAD (DGN) package is substantially improved over the traditional SO package. Maximum power dissipation levels are depicted in Figure 10-3 for the two packages. The data for the DGN package assume a board layout that follows the PowerPAD layout guidelines.

Figure 10-3 Maximum Power Dissipation vs Ambient Temperature