For best operational performance of the device, use good PCB layout practices, including:
The OPAx277 series uses the 8-lead DFN (also known as SON), a QFN package with contacts on only two sides of the package bottom. This leadless, near-chip-scale package maximizes board space and enhances thermal and electrical characteristics through an exposed pad.
DFN packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics, with a pinout scheme that is consistent with other commonly-used packages, such as SO and MSOP. Additionally, the absence of external leads eliminates bent-lead issues.
The DFN package can be easily mounted using standard printed-circuit-board (PCB) assembly techniques. See QFN/SON PCB Attachment (SLUA271) and Quad Flatpack No-Lead Logic Packages (SCBA017), both available for download at www.ti.com.
The exposed leadframe die pad on the bottom of the package should be connected to V–.