JAJSJV3W July   2001  – September 2020 SN74LVC1G17

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics—DC Limit Changes
    6. 6.6  Switching Characteristics, CL = 15 pF
    7. 6.7  Switching Characteristics AC Limit, –40°C TO 85°C
    8. 6.8  Switching Characteristics AC Limit, –40°C TO 125°C
    9. 6.9  Operating Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
  9. 9 Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DPW|5
  • DBV|5
  • DSF|6
  • DCK|5
  • YZV|4
  • DRL|5
  • YZP|5
  • DRY|6
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)SN74LVC1G17UNIT
DBVDCKDRLDRYYZPDPWYZV
5 PINS5 PINS5 PINS6 PINS5 PINS4 PINS4 PINS
RθJAJunction-to-ambient thermal resistance229280350608130340181°C/W
RθJC(top)Junction-to-case (top) thermal resistance16466121432542151
RθJBJunction-to-board thermal resistance62671714465129439
ψJTJunction-to-top characterization parameter442111911418
ψJBJunction-to-board characterization parameter62661694425029438
RθJC(bot)Junction-to-case (bottom) thermal resistance–––198–250–
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.