SCPS202C October   2009  – May 2016 TCA9539

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Requirements
    7. 6.7 RESET Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 I/O Port
      2. 8.3.2 RESET Input
      3. 8.3.3 Interrupt (INT) Output
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
    6. 8.6 Register Maps
      1. 8.6.1 Device Address
      2. 8.6.2 Control Register and Command Byte
      3. 8.6.3 Register Descriptions
        1. 8.6.3.1 Bus Transactions
          1. 8.6.3.1.1 Writes
          2. 8.6.3.1.2 Reads
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 Calculating Junction Temperature and Power Dissipation
        2. 9.2.1.2 Minimizing ICC When I/Os Control LEDs
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-On Reset Requirements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Community Resources
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VCC Supply voltage –0.5 6 V
VI Input voltage(2) –0.5 6 V
VO Output voltage (2) –0.5 6 V
IIK Input clamp current VI < 0 –20 mA
IOK Output clamp current VO < 0 –20 mA
IIOK Input-output clamp current VO < 0 or VO > VCC ±20 mA
IOL Continuous output low current VO = 0 to VCC 50 mA
IOH Continuous output high current VO = 0 to VCC –50 mA
ICC Continuous current through GND –250 mA
Continuous current through VCC 160
Tj(MAX) Maximum junction temperature 100 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions.

6.3 Recommended Operating Conditions

MIN MAX UNIT
VCC Supply voltage 1.65 5.5 V
VIH High-level input voltage SCL, SDA 0.7 × VCC VCC (1) V
A0, A1, RESET, P07–P00, P10–P17 0.7 × VCC 5.5
VIL Low-level input voltage SCL, SDA, A0, A1, RESET, P07–P00, P10–P17 –0.5 0.3 × VCC V
IOH High-level output current P07–P00, P17–P10 –10 mA
IOL Low-level output current(2) P00–P07, P10–P17 Tj ≤ 65°C 25 mA
Tj ≤ 85°C 18
Tj ≤ 100°C 11
IOL Low-level output current(2) INT, SDA Tj ≤ 85°C 6 mA
Tj ≤ 100°C 3.5
TA Operating free-air temperature –40 85 °C
(1) For voltages applied above VCC, an increase in ICC will result.
(2) The values shown apply to specific junction temperatures, which depend on the RθJA of the package used. See the Calculating Junction Temperature and Power Dissipation section on how to calculate the junction temperature.

6.4 Thermal Information

THERMAL METRIC (1) TCA9539 UNIT
PW (TSSOP) RTW (WQFN) RGE (VQFN)
24 PINS 24 PINS 24 PINS
RθJA Junction-to-ambient thermal resistance 108.8 43.6 48.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 54. 46.2 58.1 °C/W
RθJB Junction-to-board thermal resistance 62.8 22.1 27.1 °C/W
ψJT Junction-to-top characterization parameter 11.1 1.5 3.3 °C/W
ψJB Junction-to-board characterization parameter 62.3 22.2 27.2 °C/W
RθJC(bottom) Junction-to-case (bottom) thermal resistance 10.7 15.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP (1) MAX UNIT
VIK Input diode clamp voltage II = –18 mA 1.65 V to 5.5 V –1.2 V
VPORR Power-on reset voltage, VCC rising VI = VCC or GND, IO = 0 1.65 V to 5.5 V 1.2 1.5 V
VPORF Power-on reset voltage, VCC falling 1.65 V to 5.5 V 0.75 1
VOH P-port high-level output voltage (2) IOH = –8 mA 1.65 V 1.2 V
2.3 V 1.8
3 V 2.6
4.75 V 4.1
IOH = –10 mA 1.65 V 1
2.3 V 1.7
3 V 2.5
4.75 V 4
IOL SDA VOL = 0.4 V 1.65 V to 5.5 V 3 mA
P port (3) VOL = 0.5 V 1.65 V to 5.5 V 8
VOL = 0.7 V 1.65 V to 5.5 V 10
INT VOL = 0.4 V 3
II SCL, SDA VI = VCC or GND 1.65 V to 5.5 V ±1 μA
A0, A1, RESET ±1
IIH P port VI = VCC 1.65 V to 5.5 V 1 μA
IIL P port VI = GND 1.65 V to 5.5 V –1 μA
ICC Operating mode VI = VCC or GND, IO = 0,
I/O = inputs, fSCL = 400 kHz, no load
5.5 V 22 40 μA
3.6 V 11 30
2.7 V 8 19
1.95 V 5 11
Standby mode VI = VCC or GND, IO = 0, I/O = inputs,
fSCL = 0 kHz, no load
VI = VCC 5.5 V 1.5 3.9
3.6 V 0.9 2.2
2.7 V 0.6 1.8
1.95 V 0.4 1.5
VI = GND 5.5 V 1.5 8.7
3.6 V 0.9 4
2.7 V 0.6 3
1.95 V 0.4 2.2
Ci SCL VI = VCC or GND 1.65 V to 5.5 V 3 8 pF
Cio SDA VIO = VCC or GND 1.65 V to 5.5 V 3 9.5 pF
P port 3.7 9.5
(1) All typical values are at nominal supply voltage (1.8-, 2.5-, 3.3-, or 5-V VCC) and TA = 25°C.
(2) Each I/O must be externally limited to a maximum of 25 mA, and each octal (P07–P00 and P17–P10) must be limited to a maximum current of 100 mA, for a device total of 200 mA.
(3) The total current sourced by all I/Os must be limited to 160 mA (80 mA for P07–P00 and 80 mA for P17–P10).

6.6 I2C Interface Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 19)
MIN MAX UNIT
I2C BUS—STANDARD MODE
fscl I2C clock frequency 0 100 kHz
tsch I2C clock high time 4 µs
tscl I2C clock low time 4.7 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 250 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 1000 ns
ticf I2C input fall time 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 300 ns
tbuf I2C bus free time between stop and start 4.7 µs
tsts I2C start or repeated start condition setup 4.7 µs
tsth I2C start or repeated start condition hold 4 µs
tsps I2C stop condition setup 4 µs
tvd(data) Valid data time SCL low to SDA output valid 3.45 µs
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low
3.45 µs
Cb I2C bus capacitive load 400 pF
MIN MAX UNIT
I2C BUS—FAST MODE
fscl I2C clock frequency 0 400 kHz
tsch I2C clock high time 0.6 µs
tscl I2C clock low time 1.3 µs
tsp I2C spike time 50 ns
tsds I2C serial-data setup time 100 ns
tsdh I2C serial-data hold time 0 ns
ticr I2C input rise time 20 300 ns
ticf I2C input fall time 20 × (VCC / 5.5 V) 300 ns
tocf I2C output fall time 10-pF to 400-pF bus 20 × (VCC / 5.5 V) 300 ns
tbuf I2C bus free time between stop and start 1.3 µs
tsts I2C start or repeated start condition setup 0.6 µs
tsth I2C start or repeated start condition hold 0.6 µs
tsps I2C stop condition setup 0.6 µs
tvd(data) Valid data time SCL low to SDA output valid 0.9 µs
tvd(ack) Valid data time of ACK condition ACK signal from SCL low to
SDA (out) low
0.9 µs
Cb I2C bus capacitive load 400 pF

6.7 RESET Timing Requirements

over recommended operating free-air temperature range (unless otherwise noted) (see Figure 22)
MIN MAX UNIT
tW Reset pulse duration 6 ns
tREC Reset recovery time 0 ns
tRESET Time to reset; for VCC = 2.3 V - 5.5 V 400 ns
Time to reset; for VCC = 1.65 V - 2.3 V 550 ns

6.8 Switching Characteristics

over recommended operating free-air temperature range, CL ≤ 100 pF (unless otherwise noted) (see Figure 20 and Figure 21)
PARAMETER FROM
(INPUT)
TO
(OUTPUT)
MIN MAX UNIT
tiv Interrupt valid time P port INT 4 μs
tir Interrupt reset delay time SCL INT 4 μs
tpv Output data valid; For VCC = 2.3 V - 5.5 V SCL P port 200 ns
Output data valid; For VCC = 1.65 V - 2.3 V 300 ns
tps Input data setup time P port SCL 150 ns
tph Input data hold time P port SCL 1 μs

6.9 Typical Characteristics

TA = 25°C (unless otherwise noted)
TCA9539 D001_TCA9539.gif
Figure 1. Supply Current vs Temperature for Different Supply Voltage (VCC)
TCA9539 D003_TCA9539.gif
Figure 3. Supply Current vs Supply Voltage for Different Temperature (TA)
TCA9539 D005_TCA9539.gif
Figure 5. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 1.8 V
TCA9539 D007_TCA9539.gif
Figure 7. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 3.3 V
TCA9539 D010_TCA9539.gif
Figure 9. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 5.5 V
TCA9539 D012_TCA9539.gif
Figure 11. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 1.65 V
TCA9539 D014_TCA9539.gif
Figure 13. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 2.5 V
TCA9539 D016_TCA9539.gif
Figure 15. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 5 V
TCA9539 D018_TCA9539.gif
Figure 17. VCC – VOH Voltage vs Temperature for Different VCC
TCA9539 D002_TCA9539.gif
Figure 2. Standby Supply Current vs Temperature for Different Supply Voltage (VCC)
TCA9539 D004_TCA9539.gif
Figure 4. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 1.65 V
TCA9539 D006_TCA9539.gif
Figure 6. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 2.5 V
TCA9539 D009_TCA9539.gif
Figure 8. I/O Sink Current vs Output Low Voltage for Different Temperature (TA) for VCC = 5 V
TCA9539 D011_TCA9539.gif
Figure 10. II/O Low Voltage vs Temperature for Different VCC and IOL
TCA9539 D013_TCA9539.gif
Figure 12. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 1.8 V
TCA9539 D015_TCA9539.gif
Figure 14. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 3.3 V
TCA9539 D017_TCA9539.gif
Figure 16. I/O Source Current vs Output High Voltage for Different Temperature (TA) for VCC = 5.5 V
TCA9539 D019_TCA9539.gif
A.
Figure 18. Δ ICC vs Temperature for Different VCC (VI = VCC – 0.6 V)