JAJSFE9J August   2018  – February 2024 TLV9051 , TLV9052 , TLV9054

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics: VS (Total Supply Voltage) = (V+) – (V–) = 1.8 V to 5.5 V
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Rail-to-Rail Input
      3. 7.3.3 Rail-to-Rail Output
      4. 7.3.4 EMI Rejection
      5. 7.3.5 Overload Recovery
      6. 7.3.6 Packages With an Exposed Thermal Pad
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Input Protection
      9. 7.3.9 Shutdown Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Low-Side Current Sense Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information for Single Channel

THERMAL METRIC(1)TLV9051, TLV9051SUNIT
DPW (X2SON)DBV (SOT-23)DCK (SC70)DRL (SOT553)(2)
5 PINS5 PINS6 PINS5 PINS5 PINS
RθJAJunction-to-ambient thermal resistance470.0228.1210.8231.2TBD°C/W
RθJC(top)Junction-to-case(top) thermal resistance211.9152.1152.1144.4TBD°C/W
RθJBJunction-to-board thermal resistance334.897.792.378.6TBD°C/W
ψJTJunction-to-top characterization parameter29.874.176.251.3TBD°C/W
ψJBJunction-to-board characterization parameter333.297.392.178.3TBD°C/W
RθJC(bot)Junction-to-case(bottom) thermal resistanceN/AN/AN/AN/ATBD°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) This package option is for preview only.