JAJSJS6A June   2021  – September 2021 TMAG5273

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Temperature Sensor
    7. 6.7  Magnetic Characteristics For A1
    8. 6.8  Magnetic Characteristics For A2
    9. 6.9  Magnetic Temp Compensation Characteristics
    10. 6.10 I2C Interface Timing
    11. 6.11 Power up & Conversion Time
    12. 6.12 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Magnetic Flux Direction
      2. 7.3.2 Sensor Location
      3. 7.3.3 Interrupt Function
      4. 7.3.4 Device I2C Address
      5. 7.3.5 Magnetic Range Selection
      6. 7.3.6 Update Rate Settings
    4. 7.4 Device Functional Modes
      1. 7.4.1 Stand-by (Trigger) Mode
      2. 7.4.2 Sleep Mode
      3. 7.4.3 Wake-up and Sleep (W&S) Mode
      4. 7.4.4 Continuous Measure Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 SCL
        2. 7.5.1.2 SDA
        3. 7.5.1.3 I2C Read/Write
          1. 7.5.1.3.1 Standard I2C Write
          2. 7.5.1.3.2 General Call Write
          3. 7.5.1.3.3 Standard 3-Byte I2C Read
          4. 7.5.1.3.4 1-Byte I2C Read Command for 16-Bit Data
          5. 7.5.1.3.5 1-Byte I2C Read Command for 8-Bit Data
          6. 7.5.1.3.6 I2C Read CRC
      2. 7.5.2 Data Definition
        1. 7.5.2.1 Magnetic Sensor Data
        2. 7.5.2.2 Temperature Sensor Data
        3. 7.5.2.3 Angle and Magnitude Data Definition
        4. 7.5.2.4 Magnetic Sensor Offset Correction
    6. 7.6 Register Map
      1. 7.6.1 TMAG5273 Registers
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Select the Sensitivity Option
      2. 8.1.2 Temperature Compensation for Magnets
      3. 8.1.3 Sensor Conversion
        1. 8.1.3.1 Continuous Conversion
        2. 8.1.3.2 Trigger Conversion
        3. 8.1.3.3 Pseudo-Simultaneous Sampling
      4. 8.1.4 Magnetic Limit Check
      5. 8.1.5 Error Calculation During Linear Measurement
      6. 8.1.6 Error Calculation During Angular Measurement
    2. 8.2 Typical Application
      1. 8.2.1 Magnetic Tamper Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 I2C Address Expansion
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Angle Measurement
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1 Gain Adjustment for Angle Measurement
        3. 8.2.3.3 Application Curves
    3. 8.3 What to Do and What Not to Do
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
over recommended VCC range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SDA, INT
VOL Output LOW voltage, SDA, INT pin IOUT = 2mA 0 0.4 V
IOZ Output leakage current, SDA, INT pin Output disabled, VOZ = 5.5V ±100 nA
tFALL_INT INT output fall time RPU =10KΩ, CL =20pF, VPU =1.65V to 5.5V 6 ns
tINT (INT) INT Interrupt  time duration during pulse mode INT_MODE =001b or 010b 10 µs
tINT (SCL) SCL Interrupt  time duration INT_MODE =011b or 100b 10 µs
DC POWER SECTION
VCCUV (1) Under voltage threshold at VCC VCC = 2.3V to 3.6V 1.9 2.0 2.2 V
IACTIVE Active mode current  X, Y, Z, or thermal sensor active conversion, LP_LN =0b 2.3 mA
IACTIVE Active mode current  X, Y, Z, or thermal sensor active conversion, LP_LN =1b 3.0 mA
ISTANDBY Stand-by mode current Device in trigger mode, no conversion started 0.45 mA
ISLEEP Sleep mode current 5 nA
AVERAGE POWER DURING WAKE-UP AND SLEEP (W&S) MODE
ICC_DCM_1000_1 W&S mode current consumption Wake-up interval 1-ms, magnetic 1-ch conversion, LP_LN =0b, VCC =3.3V 160 µA
ICC_DCM_1000_1 W&S mode current consumption Wake-up interval 1-ms, magnetic 1-ch conversion, LP_LN =0b, VCC =1.8V 156 µA
ICC_DCM_1000_4 W&S mode current consumption Wake-up interval 1-ms, 4-ch conversion, LP_LN =0b, VCC =3.3V 240 µA
ICC_DCM_1000_4 W&S mode current consumption Wake-up interval 1-ms, 4-ch conversion, LP_LN =0b, VCC =1.8V 233 µA
ICC_DCM_0p2_1 W&S mode current consumption Wake-up interval 5000-ms, magnetic 1-ch conversion, LP_LN =0b, VCC =3.3V 1.21 µA
ICC_DCM_0p2_1 W&S mode current consumption Wake-up interval 5000-ms, magnetic 1-ch conversion, LP_LN =0b, VCC =1.8V 1.00 µA
ICC_DCM_0p2_4 W&S mode current consumption Wake-up interval 5000-ms, 4-ch conversion, LP_LN =0b, VCC =3.3V 1.22 µA
ICC_DCM_0p2_4 W&S mode current consumption Wake-up interval 5000-ms, 4-ch conversion, LP_LN =0b, VCC =1.8V 1.02 µA
The DIAG_STATUS and VCC_UV_ER bits are not valid for VCC < 2.3V