JAJSFO5C June   2018  – April 2021 TMP117

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Two-Wire Interface Timing
    8. 6.8 Timing Diagram
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Power Up
      2. 7.3.2 Averaging
      3. 7.3.3 Temperature Result and Limits
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous Conversion Mode
      2. 7.4.2 Shutdown Mode (SD)
      3. 7.4.3 One-Shot Mode (OS)
      4. 7.4.4 Therm and Alert Modes
        1. 7.4.4.1 Alert Mode
        2. 7.4.4.2 Therm Mode
    5. 7.5 Programming
      1. 7.5.1 EEPROM Programming
        1. 7.5.1.1 EEPROM Overview
        2. 7.5.1.2 Programming the EEPROM
      2. 7.5.2 Pointer Register
      3. 7.5.3 I2C and SMBus Interface
        1. 7.5.3.1 Serial Interface
          1. 7.5.3.1.1 Bus Overview
          2. 7.5.3.1.2 Serial Bus Address
          3. 7.5.3.1.3 Writing and Reading Operation
          4. 7.5.3.1.4 Slave Mode Operations
            1. 7.5.3.1.4.1 Slave Receiver Mode
            2. 7.5.3.1.4.2 Slave Transmitter Mode
          5. 7.5.3.1.5 SMBus Alert Function
          6. 7.5.3.1.6 General-Call Reset Function
          7. 7.5.3.1.7 Timeout Function
          8. 7.5.3.1.8 Timing Diagrams
    6. 7.6 Register Map
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Noise and Averaging
        2. 8.2.2.2 Self-Heating Effect (SHE)
        3. 8.2.2.3 Synchronized Temperature Measurements
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  12. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DRV|6
  • YBG|6
サーマルパッド・メカニカル・データ
発注情報

4 Revision History

Changes from Revision B (March 2019) to Revision C (April 2021)

  • 文書全体にわたって表、図、相互参照の採番方法を更新Go
  • 限定された温度範囲に対する最小電源定格を 1.7V に変更Go
  • 「概要」の最小電源電圧を更新Go
  • Added 1.7 V supply rating for in Recommended Operating ConditionsGo
  • Updated Long term stability and drift conditions from 300 hrs to 1000 hrsGo
  • Corrected ALERT Pin Output Voltage vs Pin Sink Current labelsGo
  • Added I2C behavior notesGo
  • Updated Power Supply Recommendations to reflect new 1.7 V supply ratingGo
  • Updated documentation linksGo

Changes from Revision A (October 2018) to Revision B (March 2019)

  • 医療グレードの仕様と RTD 代替情報を「特長」セクションに移動Go
  • 「アプリケーション」の箇条書きを変更Go
  • YBG (DSBGA) パッケージ情報を追加Go
  • YBG パッケージの精度の画像を追加Go
  • 精度の画像を変更し DRV パッケージを追加Go
  • Changed TJ(MAX) from 150 °C to 155 °CGo
  • Added YBG package thermal informationGo
  • Added YBG package temperature accuracy chartGo
  • Changed conversion cycle timing diagramGo
  • Changed one-shot timing diagram with AVG[1:0] = 00Go
  • Changed alert mode timing diagramGo
  • Changed therm mode timing diagramGo
  • Changed write word command timing diagramGo
  • Changed read word command timing diagramGo
  • Changed SMBus alert timing diagramGo
  • Changed general-call reset command timing diagramGo
  • Updated the formatting in the Register Map sectionGo
  • Added return links to the register descriptionsGo
  • Fixed access type code location and descriptionsGo
  • Changed typical connections diagramGo
  • Added YBG package layout exampleGo

Changes from Revision * (June 2018) to Revision A (October 2018)

  • デバイスのステータスを「事前情報」から「量産データ」に変更Go
  • シャットダウン電流を250nA から150nA に変更Go