SBVS190E March   2012  – December 2015 TPS7A7300

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configurations
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 User-Configurable Output Voltage
      2. 7.3.2 Traditional Adjustable Configuration
      3. 7.3.3 Undervoltage Lockout (UVLO)
      4. 7.3.4 Soft-Start
      5. 7.3.5 Current Limit
      6. 7.3.6 Enable
      7. 7.3.7 Power Good
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Dropout Operation
      3. 7.4.3 Disabled
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ANY-OUT Programmable Output Voltage
        2. 8.2.2.2 Traditional Adjustable Output Voltage
        3. 8.2.2.3 Input Capacitor Requirements
        4. 8.2.2.4 Output Capacitor Requirements
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Power Dissipation
    5. 10.5 Estimating Junction Temperature
  11. 11Device And Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, And Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

5 Pin Configurations

RGW Package
20-Pin VQFN With Exposed Thermal Pad
Top View
TPS7A7300 po_bvs136.gif

Pin Functions

PIN I/O DESCRIPTION
NAME RGW
50mV, 100mV, 200mV, 400mV, 800mV, 1.6V 5, 6, 7,
9, 10, 11
I Output voltage setting pins. These pins must be connected to ground or left floating. Connecting these pins to ground increases the output voltage by the value of the pin name; multiple pins can be simultaneously connected to GND to select the desired output voltage. Leave these pins floating (open) when not in use. See the User-Configurable Output Voltage section for more details.
EN 14 I Enable pin. Driving this pin to logic high enables the device; driving the pin to logic low disables the device. See the Enable section for more details.
FB 3 I Output voltage feedback pin. Connected to the error amplifier. See the User-Configurable Output Voltage and Traditional Adjustable Configuration sections for more details. TI highly recommends connecting a 220-pF ceramic capacitor from FB pin to OUT.
GND 8, 18 Ground pin.
IN 15, 16, 17 I Unregulated supply voltage pin. TI recommends connecting an input capacitor to this pin. See Input Capacitor Requirements for more details.
NC 12 Not internally connected. The NC pin is not connected to any electrical node. TI strongly recommends connecting this pin and the thermal pad to a large-area ground plane. See the Power Dissipation section for more details.
OUT 1, 19, 20 O Regulated output pin. A 4.7-μF or larger capacitance is required for stability. See Output Capacitor Requirements for more details.
PG 4 O Active-high power good pin. An open-drain output that indicates when the output voltage reaches 90% of the target. See Power Good for more details.
SNS 2 I Output voltage sense input pin. See the User-Configurable Output Voltage and Traditional Adjustable Configuration sections for more details.
SS 13 Soft-start pin. Leaving this pin open provides soft start of the default setting.
Connecting an external capacitor between this pin and the ground enables the soft-start function by forming an RC-delay circuit in combination with the integrated resistance on the silicon. See the Soft-Start section for more details.
Thermal Pad TI strongly recommends connecting the thermal pad to a large-area ground plane. If available, connect an electrically-floating, dedicated thermal plane to the thermal pad as well.