Thermal dissipation is the primary consideration
for TPS92623-Q1 layout.
- TI recommends large thermal dissipation area in
both top and bottom layers of PCB. The copper pouring area in same layer with
TPS92623-Q1 footprint must directly cover the
thermal pad land of the device with wide connection as much as possible. The
copper pouring in opposite PCB layer or inner layers must be connected to
thermal pad directly through multiple thermal vias.
- TI recommends to place R(RESx)
resistors away from the TPS92623-Q1 device with more than 20-mm
distance, because R(RESx) resistors are dissipating some amount of
the power as well as the TPS92623-Q1. Place two heat source components
apart to reduce the thermal accumulation concentrated at small PCB area. The
large copper pouring area is also required surrounding the R(RESx)
resistors for helping thermal dissipating.
The noise immunity is the secondary consideration
for TPS92623-Q1 layout.
- TI recommends to place the noise decoupling capacitors for SUPPLY pin as close as possible to the pins.
- TI recommends to place the R(SNSx) resistor as close as possible to the INx pins with the shortest PCB track to SUPPLY pin.