JAJSFO7D March   2008  – November 2023 UCC27324-Q1

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Overall Electrical Characteristics
    6. 5.6  Power Dissipation Characteristics
    7. 5.7  Input (INA, INB) Electrical Characteristics
    8. 5.8  Output (OUTA, OUTB) Electrical Characteristics
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Input Stage
      2. 6.3.2 Output Stage
    4. 6.4 Device Functional Modes
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Parallel Outputs
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Propagation Delay
        2. 7.2.2.2 Source and Sink Capabilities During Miller Plateau
        3. 7.2.2.3 Supply Voltage (VDD)
        4. 7.2.2.4 Drive Current and Power Requirements
      3. 7.2.3 Application Curve
  9. Power Supply Recommendations
  10. Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 サード・パーティ製品に関する免責事項
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 ドキュメントの更新通知を受け取る方法
    4. 10.4 サポート・リソース
    5. 10.5 Trademarks
    6. 10.6 静電気放電に関する注意事項
    7. 10.7 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the package. For a power driver to be useful over a particular temperature range, the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The UCC27324-Q1 device of drivers is available in three different packages to cover a range of application requirements.

As shown in Section 5.4, the SOIC-8 (D) package has power ratings of approximately 0.5 W at TA = 70°C. This limit is imposed in conjunction with the power derating factor also given in the table. Note that the power dissipation in our earlier example is 0.432 W with a 10-nF load, 12-V VDD, switched at 300 kHz. Thus, only one load of this size could be driven using the D or P package, even if the two onboard drivers are paralleled. The difficulties with heat removal limit the drive available in the older packages.