JAJSJJ4C August   2007  – December 2024 TRSF3232E

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  ESD Protection, Driver
    4. 5.4  ESD Protection, Receiver
    5. 5.5  Recommended Operating Conditions
    6. 5.6  Thermal Information
    7. 5.7  Electrical Characteristics
    8. 5.8  Electrical Characteristics, Driver
    9. 5.9  Electrical Characteristics, Receiver
    10. 5.10 Switching Characteristics, Driver
    11. 5.11 Switching Characteristics, Reveiver
    12. 5.12 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power
      2. 7.3.2 RS232 Driver
      3. 7.3.3 RS232 Receiver
    4. 7.4 Device Functional Modes
      1. 7.4.1 VCC Powered by 3V to 5.5V
      2. 7.4.2 VCC Unpowered, VCC = 0V
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 商標
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11メカニカル、パッケージ、および注文情報

5.6 Thermal Information

THERMAL METRIC(1)TRSF3232EUNIT
PW (TSSOP)D (SOIC)DW (SOIC)

DB

(SSOP)		RGT (VQFN)DYY
(SOT-23-THN)
16 Pins16 Pins16 Pins16 Pins16 Pins16 Pins
R θJAJunction-to-ambient thermal resistance 108.285.9574648.8

106.2

°C/W
R θJC(top)Junction-to-case (bottom) thermal resistance 39.0 43.1 33.5 36.2 55.8

47.4

°C/W
R θJBJunction-to-board thermal resistance 54.4 44.5 37.1 43.8 23.2

44.7

°C/W
ψ JTJunction-to-top characterization parameter 3.3 10.1 7.54.2 1.7

1.7

°C/W
ψ JBJunction-to-board characterization parameter 53.8 44.1 37.1 42.9 23.2

43.7

°C/W
R θJC(bot)Junction-to-case (bottom) thermal resistance N/A N/A N/A N/A 9.0

N/A

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.