SCDA008C June   2021  – November 2021 CD4052B , TS3A225E , TS3A44159

 

  1.   Trademarks
  2. 1Introduction
  3. 2Semiconductor Switches
    1. 2.1 NMOS Switch
    2. 2.2 PMOS Switch
  4. 3Basic Signal-Switch Structures
    1. 3.1 NMOS Series Switch
    2. 3.2 NMOS/PMOS Parallel Switch
    3. 3.3 NMOS Series Switch with the Charge Pump
  5. 4Key Concerns in Digital-Switch Applications
    1. 4.1  Power and Control Voltage Requirements
    2. 4.2  Rail-to-Rail Operation
    3. 4.3  Undershoot
    4. 4.4  ron
    5. 4.5  Cio(off)
    6. 4.6  Cio(on)
    7. 4.7  Ci (Control Input Capacitance)
    8. 4.8  Leakage Current
    9. 4.9  Enable and Disable Delays and Propagation Delay
    10. 4.10 Partial Power Down
    11. 4.11 Voltage Translation
  6. 5Signal Switch Families
    1. 5.1 CBT-C Family
      1. 5.1.1 Characteristics of CBT-C Family
        1. 5.1.1.1 VOvs VI
        2. 5.1.1.2 ron vs VI
        3. 5.1.1.3 Undershoot Protection
      2. 5.1.2 Application of CBT-C Family
        1. 5.1.2.1 Bus Isolation
    2. 5.2 CBTLV Family
      1. 5.2.1 Characteristics of the CBTLV Family
    3. 5.3 CB3Q Family
      1. 5.3.1 Characteristics of the CB3Q Family
        1. 5.3.1.1 VOvs VI
        2. 5.3.1.2 ron vs VI
        3. 5.3.1.3 Operation at High Frequency
        4. 5.3.1.4 Output Skew
        5. 5.3.1.5 Frequency Response
        6. 5.3.1.6 Adjacent Channel Crosstalk
      2. 5.3.2 Application of the CB3Q Family
        1. 5.3.2.1 Multiplexer in USB Applications
    4. 5.4 CB3T Family
      1. 5.4.1 Characteristics of the CB3T Family
        1. 5.4.1.1 VO vs VI
        2. 5.4.1.2 ron vs VI
        3. 5.4.1.3 Operation at High Frequency
      2. 5.4.2 Application of the CB3T Family
        1. 5.4.2.1 Voltage Translation for an External Monitor Terminal in a Notebook PC
  7. 6Applications
    1. 6.1 Multiplexing USB Peripherals
    2. 6.2 Multiplexing Ethernet
    3. 6.3 Notebook Docking Station
  8. 7Conclusion
  9. 8References
  10. 9Revision History
  11.   A Test Measurement Circuits
    1.     A.1 Measurement Setup for ron
    2.     A.2 Measurement Setup for VO vs VI Characteristics
    3.     A.3 Voltage-Time Waveform Measurement (Switch On)
    4.     A.4 Voltage-Time Waveform Measurement (Switch Off)
    5.     A.5 Output-Skew Measurement
    6.     A.6 Simulation Setup for Undershoot Measurement
    7.     A.7 Laboratory Setup for Attenuation Measurement
    8.     A.8 Laboratory Setup for Off Isolation Measurement
    9.     A.9 Laboratory Setup for Crosstalk Measurement

NMOS/PMOS Parallel Switch

An NMOS/PMOS parallel switch consists of an n-channel pass transistor in parallel with ap-channel pass transistor. Figure 3-3 shows the basic structure of an NMOS/PMOS parallel switch. In an n-channel MOSFET, the source-to-drain resistance is low when the drain voltage is less than VG – VT, where VG is the gate voltage. In a p-channel MOSFET, the source-to-drain resistance is low when the source voltage is greater than VT + VG. with the parallel combination of n-channel and p-channel pass transistors, the source-to-drain, or channel resistance, can be lowered for the entire input voltage range from 0 V to VG. When OE is low, VG in NMOS/PMOS parallel switch is VCC, and signals ranging from 0 V to VCC can be passed through this switch. Figure 3-4 shows the general shape of the ron versus VI characteristics of a typical NMOS/PMOS parallel switch, as well as the NMOS and PMOS characteristics. The shape of ron vs VI curve may be different, depending on the structures of NMOS and PMOS. The disadvantage of the NMOS/PMOS parallel switch is that the input and output capacitances increase due to the additional source and drain area of the combined transistors.

GUID-FC8E5DB0-75EC-4F1D-A0E3-CF19D97B33C5-low.gifFigure 3-3 Basic Structure of an NMOS/PMOS Parallel Switch
GUID-D05F0262-E059-48BF-841B-3D9FE4DBF171-low.gifFigure 3-4 ron vs VI Characteristics of a Typical NMOS/PMOS Parallel Switch (VCC = 5 V)