SFFS192 March   2022 UCC5350-Q1 , UCC5390-Q1

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)

Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for UCC5350-Q1 and UCC5390-Q1 based on two different industry-wide used reliability standards:

  • Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11. Power dissipation: 100 mW
  • Table 2-2 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11. Power dissipation: 300 mW
  • Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2
Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 Power dissipation: 100 mW
FIT IEC TR 62380 / ISO 26262 Power FIT (Failures Per 109 Hours)
Total Component FIT Rate (UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) 12,19,19
Die FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) 5,4,4
Package FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8.UCC5390-Q1 - DWV SOIC-8 ) 7,15,15
Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 Power dissipation: 300 mW
FIT IEC TR 62380 / ISO 26262 FIT (Failures Per 109 Hours)
Total Component FIT Rate (UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) 15,24,24
Die FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) 7,8,8
Package FIT Rate ( UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8 ) 8,16,16

The failure rate and mission profile information in Table 2-1 and Table 2-2 come from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

  • Mission Profile: Motor Control from Table 11
  • Power dissipation: 100 mW, 300 mW
  • Climate type: World-wide Table 8
  • Package factor (lambda 3): Table 17b
  • Substrate Material: FR4
  • EOS FIT rate assumed: 0 FIT
Table 2-3 Component Failure Rates per Siemens Norm SN 29500-2 of UCC5350-Q1 - D SOIC-8, UCC5350-Q1 - DWV SOIC-8,UCC5390-Q1 - DWV SOIC-8
TableCategoryReference FIT RateReference Virtual TJ
5CMOS, BICMOS
Digital, analog / mixed
22 FIT55°C

The Reference FIT Rate and Reference Virtual TJ (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.