SFFS309A April   2022  – May 2022 TPS3704 , TPS3704-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Hardware Component Failure Modes Effects and Diagnostics Analysis (FMEDA)
    1. 2.1 Random Fault Estimation
      1. 2.1.1 Fault Rate Estimation Theory for Packaging
      2. 2.1.2 Fault Estimation Theory for Silicon Permanent Faults
      3. 2.1.3 Fault Estimation Theory for Silicon Transient Faults
      4. 2.1.4 The Classification of Failure Categories and Calculation
    2. 2.2 Using the FMEDA Spreadsheet Tool
      1. 2.2.1 Mission Profile Tailoring Tab
        1. 2.2.1.1 Confidence Level
        2. 2.2.1.2 Geographical Location
        3. 2.2.1.3 Life Cycle
        4. 2.2.1.4 Use Case Thermal Management Control (Theta-Ja) and Use Case Power
        5. 2.2.1.5 Safe vs Non-Safe (Safe Fail Fraction) for Each Component Type
        6. 2.2.1.6 Analog FIT Distribution Method
        7. 2.2.1.7 Operational Profile
      2. 2.2.2 Pin Level Tailoring Tab
      3. 2.2.3 Function and Diag Tailoring Tab
      4. 2.2.4 Diagnostic Coverage Tab
      5. 2.2.5 Customer Defined Diagnostics Tab
      6. 2.2.6 Totals - ISO26262 Tab
      7. 2.2.7 Details - ISO26262 Tab
      8. 2.2.8 Totals - IEC61508 Tab
      9. 2.2.9 Details - IEC61508 Tab
    3. 2.3 Example Calculation of Metrics
      1. 2.3.1 Assumptions of Use for Calculation of Safety Metrics
      2. 2.3.2 Summary of ISO 26262 Safety Metrics at Device Level
      3. 2.3.3 Summary of IEC 61508 Safety Metrics at Device Level
  4. 3Revision History

1 Introduction

This document is a Safety Analysis Report for the Texas Instruments TPS3704x-Q1. Device numbers covered by this Safety Analysis Report include the products as shown in the device naming convention. For non automotive grade parts remove the -Q1 from the part number:

Figure 1-1 Device Naming Convention

The following information is documented in the Device Safety Manual, and will not be repeated in this document. This document will be referred to as the Safety Manual through the remainder of this document.

  • An overview of the superset product architecture
  • An overview of the development process utilized to reduce systematic failures
  • An overview of the safety architecture for management of random failures
  • The details of architecture partitions and implemented safety mechanisms

The following information is documented in the Safety Report (or certificate), and will not be repeated in this document:

  • Results of assessments of compliance to targeted standards

The user of this document should have a general familiarity with the TPS3704x-Q1. This document is intended to be used in conjunction with the pertinent data sheets, technical reference manuals, and other documentation for the products under development.

The following functional safety analyses are described in this document:

  • Hardware component FMEDA (Failure Modes Effects and Diagnostics Analysis) - The complete FMEDA is provided as a separate Excel document. Quantitative Functional Safety Analysis Report Windsor_rev1. The assumptions made in the FMEDA and the settings for tailoring the FMEDA to a specific application are described in this document.