SFFS380 February   2022 TIOL112 , TIOL1123 , TIOL1125

 

  1.   Trademarks
  2. 1Overview
  3. 2Functional Safety Failure In Time (FIT) Rates
  4. 3Failure Mode Distribution (FMD)
  5. 4Pin Failure Mode Analysis (Pin FMA)
  6. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a Failure Mode Analysis (FMA) for the pins of the TIOL112, TIOL1123, and TIOL1125. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

  • Pin short-circuited to Ground (L-) (see Table 4-2)
  • Pin open-circuited (see Table 4-3)
  • Pin short-circuited to an adjacent pin (see Table 4-4)
  • Pin short-circuited to L+ (see Table 4-5 and )
  • Pin short-circuited to VCC_OUT (for TIOL1123, TIOL1125, see Table 4-6)

  • Pin short-circuited to VCC_IN (for TIOL112, see Table 4-7)

Table 4-2 through Table 4-7 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality
BNo device damage, but loss of functionality
CNo device damage, but performance degradation
DNo device damage, no impact to functionality or performance

Figure 4-1 and Figure 4-2show the pin diagram for TIOL112(x) family. For a detailed description of the device pins please refer to the 'Pin Configuration and Functions ' section in the TIOL112(x) datasheet.

Figure 4-1 Pin Diagram (TIOL112)

Figure 4-2 Pin Diagram (TIOL1123, TIOL1125)
Following are the assumptions of use and the device configuration assumed for the pin FMA in this section:
  • All conditions meet recommended operating conditions

Table 4-2 Pin FMA for Device Pins Short-Circuited to Ground (L-)
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT (TIOL1123, TIOL1125)

1

Device I/O logic blocks unpowered. Although LDO current is internally limited to 35 mA ±20%, thermal shutdown may be activated depending upon ambient temperature and the power dissipation in the LDO.B

VCC_IN (TIOL112)

Device not functional. Logic I/O blocks powered by VCC_IN will be unpowered. No communication with MCU.

B

NFAULT2Incorrect fault indicator output. Microcontroller will assume device is in the fault state for the duration of the short event. B
RX3Receiver output stuck at low fault. B
TX4CQ output will be stuck at high (high-side switch ON) for the duration of the short event if EN is high. Device transmitter is not functional.B
EN5Device Driver is always tri-stated. Device transmitter is not functional.B
ILIM_ADJ6Device operates with a different current limit setting than intended. Overcurrent fault will be indicated without blanking time and the driver will not be disabled due to overcurrent fault.

B

L-

7NoneD
CQ8

CQ output stuck at low and no commnunication is possible. When EN=H and TX=LOW, device will go into current fault due to overcurrent condition cycling into driver turn-off and auto-recovery cycles. Thermal shutdown may be triggered.

B

L+9Device is unpowered and not functional.B
WAKE10IO-link wake-up functionality will not work as intended. Microprocessor may recognize the short event as a wake-up event and turn-off the driver.B

Thermal Pad

-

None

D

Table 4-3 Pin FMA for Device Pins Open-Circuited
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT

(TIOL1123, TIOL1125)

1Sensor/Microcontroller will not be functional if VCC_OUT is powering the sensor/microcontroller. B

VCC_IN (TIOL112)

Device will not be functional. Logic I/O blocks powered by VCC_IN will be unpowered. No communication with MCU.

B

NFAULT2No NFAULT information provided to the microcontrollerB
RX3Data will not be received by the microcontrollerB
TX4No data can be transmitted from the Sensor FE/Micro to the outputB
EN5Device is always tri-stated. Device can only receive data.B
ILIM_ADJ6Device operates with a different current limit setting than intended. Overcurrent fault will be indicated without blanking time and the driver will not be disabled due to overcurrent fault.B
L-7Device is unpoweredB
CQ8No communication over the bus.B
L+9Device is unpoweredB
WAKE10Wake signal will not be indicated to the microcontrollerB

Thermal Pad

-

If thermal pad is not connected to GND planes in the PCB, thermal performance will not be optimal

C

Table 4-4 Pin FMA for Device Pins Short-Circuited to Adjacent Pin
Pin NamePin No.Shorted toDescription of Potential Failure Effect(s)Failure Effect Class
VCC_OUT

(TIOL1123, TIOL1125)

1NFAULTHigh ICC current during internal NFAULT active conditions. No external NFAULT active indicationB

VCC_IN (TIOL112)

High ICC_IN current during internal NFAULT active conditions. No external NFAULT active indication

B

NFAULT2

RX

Contention between driver output at the RX pin and the MCU output driving the TX input. Device functionality is lost.

B

RX3

TX

Contention between driver output at RX pin and driver output at the NFAULT pin. Receiver & fault detection functionality is lost.

B

TX4ENIf IN and EN are driven to different states communication and device state can be compromisedB
EN5NANoneD
ILIM_ADJ6

L-

Device operates at the maximum current limit. Overcurrent fault will not be indicated and the driver will not be disabled due to overcurrent fault.B
L-7

CQ

CQ output stuck at low and no commnunication is possible. When EN=H and TX=LOW, device will go into current fault due to overcurrent condition cycling into driver turn-off and auto-recovery cycles. Thermal shutdown may be triggered.

B

CQ8L+

No communication over the bus. Internal reverse polarity protection helps protect the device as long as absolute maximum operating conditions are not exceeded.

B
L+9WAKEAbsolute maximum operating condition exceeded for the WAKE pinA
WAKE10NANoneD
Note: The VSON package includes a thermal pad. All device pins are adjacent to the thermal pad. The device behavior when pins are shorted to the thermal pad depends on which net is connected to the thermal pad (recommended connection is L-).
Table 4-5 Pin FMA for Device Pins Short-Circuited to L+
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT/ VCC_IN1ABS Max violation on VCC_OUT/VCC_IN pin. Sensor FE/MCU damaged by VCC_OUT/VCC_IN over-voltage.A
NFAULT2Absolute maximum operating condition exceededA
RX3Absolute maximum operating condition exceeded A
TX4Absolute maximum operating condition exceededA
EN5Absolute maximum operating condition exceededA
ILIM_ADJ6Absolute maximum operating condition exceededA
L-7Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible.B
CQ8Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible.B
L+9NAD
WAKE10Absolute maximum operating condition exceededA
Table 4-6 Pin FMA for Device Pins Short-Circuited to VCC_OUT (TIOL1123, TIOL1125)
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_OUT1NAD
NFAULT2High current draw from the internal LDO current when the NFAULT is pulled low internal to the device. No fault indication to the microcontroller.B
RX3Receiver output will be in stuck at high fault. B
TX4Device transmitter will always output low on the bus. Device transmitter functionality is lost.B
EN5Transmitter is always enabled. Receiver will loop back the data on TX pinB
ILIM_ADJ6May cause degradation in the current limiting functionality. C
L-7Device I/O logic blocks unpowered . Thermal shutdown may be activated due to excessive current draw from the internal LDO. B
CQ8Device not functional. Ensure that the absolute maximum ratings are not exceeded otherwise device damage may be plausible on the VCC_OUT pinB
L+9Absolute maximum operating condition exceeded on VCC_OUT pin A
WAKE10IO-link wake-up functionality is lostB
Table 4-7 Pin FMA for Device Pins Short-Circuited to VCC_IN (TIOL112)
Pin NamePin No.Description of Potential Failure Effect(s)Failure Effect Class
VCC_IN1NAD
NFAULT2High current draw from the external LDO that's supplying VCC_IN when the NFAULT is pulled low internal to the device. No fault indication to the microcontroller.B
RX3Receiver output will be in stuck at high fault. If the receiver output is internally pulled low, there could be high current draw from VCC_IN. B
TX4Device transmitter will always output low on the bus. Device transmitter functionality is lost.B
EN5Transmitter is always enabled. Receiver will loop back the data on TX pinB
ILIM_ADJ6May cause degradation in the current limiting functionality. C
L-7Device I/O logic blocks unpowered. High current draw from the external LDO supplying VCC_IN. B
CQ8Communication is not possible over the bus. B
L+9Absolute maximum operating condition exceeded on VCC_IN pin

A

WAKE10IO-link wake-up functionality is lostB