SLAAER3A November   2025  – November 2025 AM2612 , AM2612-Q1 , AM263P2 , AM263P2-Q1 , AM263P4 , AM263P4-Q1 , F29H850TU , F29H859TU-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Charging Inlet, DCDC, and Host Architectures and Market Trends Toward Integration
    1. 2.1 Standalone Architecture
    2. 2.2 Integration Architecture
    3. 2.3 X-in-1 Architecture
  6. 3Charging Standards Across Regions
    1. 3.1 AC Charging Inlet Standards
    2. 3.2 DC Charging Inlet Standards
  7. 4TI Automotive MCUs for Next-Generation EV Charging
    1. 4.1 MCU Selection and Requirements for Standalone Architecture
    2. 4.2 MCU Selection and Requirements for Integration Architecture
    3. 4.3 MCU Selection and Requirements for X-in-1 Architecture
  8. 5System Block Diagram of a Charging Inlet Control System
  9. 6Conclusion
  10. 7References

4.3 MCU Selection and Requirements for X-in-1 Architecture

The multiple-in-one system places high demands on the number of cores in the MCU, real-time processing, low power consumption, security, and software development environment. The TI Sitara™ series of AM26C/Gx devices (with multiple cores) are in definition on the roadmap, providing robust hardware support for the development of integrated automotive systems.