SLAAER3A November 2025 – November 2025 AM2612 , AM2612-Q1 , AM263P2 , AM263P2-Q1 , AM263P4 , AM263P4-Q1 , F29H850TU , F29H859TU-Q1
This integration method is diverse. The charging inlet control system can be integrated in the OBC combo in physics. Deeper integration is achieved by using the same MCU with the DCDC and host subsystems. This form of integration is highly customized and seen in the global market where the charging standard is relatively simple and there are fewer functional safety requirements (especially prevalent in the Chinese market). In these instances, achieving integration is easier.
The resources required for the MCU are increasing. The MCU requires a higher number of ADC channels to sense multiple high-voltage and low-voltage signals for safety monitoring and DCDC control. The DCDC and host subsystems require redundant sensing, lock-step cores, and communication interfaces with end-to-end safing to meet the functional safety standard requirements for ASIL B through ASIL D. Additionally, the MCU requires higher computing power to meet the increased demand for DCDC high-frequency control resulting from increases of system power density.
The F29x series of C2000™ MCUs are an excellent choice for meeting the sufficient sensing resources and high-level functional safety requirements by providing:
For systems with high integration and functional safety requirements, the AM263P and AM263P-SIP are options with increased memory, up to 8MB of flash memory.