SLAU966 February   2025 MSPM0C1103 , MSPM0C1103-Q1 , MSPM0C1104 , MSPM0C1104-Q1 , MSPM0C1105 , MSPM0C1106 , MSPM0C1106-Q1 , MSPM0G1106 , MSPM0G1107 , MSPM0G1506 , MSPM0G1507 , MSPM0G1518 , MSPM0G1519 , MSPM0G3106 , MSPM0G3106-Q1 , MSPM0G3107 , MSPM0G3107-Q1 , MSPM0G3506 , MSPM0G3506-Q1 , MSPM0G3507 , MSPM0G3507-Q1 , MSPM0G3518 , MSPM0G3518-Q1 , MSPM0G3519 , MSPM0G3519-Q1 , MSPM0H3216 , MSPM0L1105 , MSPM0L1106 , MSPM0L1116 , MSPM0L1117 , MSPM0L1227 , MSPM0L1227-Q1 , MSPM0L1228 , MSPM0L1228-Q1 , MSPM0L1303 , MSPM0L1304 , MSPM0L1304-Q1 , MSPM0L1305 , MSPM0L1305-Q1 , MSPM0L1306 , MSPM0L1306-Q1 , MSPM0L1343 , MSPM0L1344 , MSPM0L1345 , MSPM0L1346 , MSPM0L2228

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1MSPM0 Portfolio Overview
    1. 1.1 Introduction
    2. 1.2 Portfolio Comparison of NXP M0 MCUs to MSPM0
  5. 2Ecosystem and Migration
    1. 2.1 Software Ecosystem Comparison
      1. 2.1.1 MSPM0 Software Development Kit (MSPM0 SDK)
      2. 2.1.2 MCUXpresso IDE vs Code Composer Studio IDE (CCS)
      3. 2.1.3 MCUXpresso Code Configuration Tool vs SysConfig
    2. 2.2 Hardware Ecosystem
    3. 2.3 Debug Tools
    4. 2.4 Migration Process
    5. 2.5 Migration and Porting Example
  6. 3Core Architecture Comparison
    1. 3.1 CPU
    2. 3.2 Embedded Memory Comparison
      1. 3.2.1 Flash Features
      2. 3.2.2 Flash Organization
        1. 3.2.2.1 Memory Banks
        2. 3.2.2.2 Flash Memory Regions
        3. 3.2.2.3 NONMAIN Memory
    3. 3.3 Power Up and Reset Summary and Comparison
    4. 3.4 Clocks Summary and Comparison
    5. 3.5 MSPM0 Operating Modes Summary and Comparison
      1. 3.5.1 Operating Modes Comparison
      2. 3.5.2 MSPM0 Capabilities in Lower Power Modes
      3. 3.5.3 Entering Lower-Power Modes
    6. 3.6 Interrupt and Events Comparison
      1. 3.6.1 Interrupts and Exceptions
      2. 3.6.2 Event Handler and Extended Interrupt and Event Controller (EXTI)
    7. 3.7 Debug and Programming Comparison
      1. 3.7.1 Bootstrap Loader (BSL) Programming Options
  7. 4Digital Peripheral Comparison
    1. 4.1 General-Purpose I/O (GPIO, IOMUX)
    2. 4.2 Universal Asynchronous Receiver-Transmitter (UART)
    3. 4.3 Serial Peripheral Interface (SPI)
    4. 4.4 I2C
    5. 4.5 Timers (TIMGx, TIMAx)
    6. 4.6 Windowed Watchdog Timer (WWDT)
    7. 4.7 Real-Time Clock (RTC)
  8. 5Analog Peripheral Comparison
    1. 5.1 Analog-to-Digital Converter (ADC)
    2. 5.2 Comparator (COMP)
    3. 5.3 Digital-to-Analog Converter (DAC)
    4. 5.4 Operational Amplifier (OPA)
    5. 5.5 Voltage References (VREF)
  9. 6References

2.3 Debug Tools

The debug subsystem (DEBUGSS) interfaces the serial wire debug (SWD) two-wire physical interface to multiple debug functions within the device. MSPM0 devices support debugging of processor execution, the device state, and the power state (using EnergyTrace technology). Figure 2-3 shows the connection of the debugger.

MSPM0 support XDS110 and J-Link debugger for standard serial wire debug.

The Texas Instruments XDS110 is designed for TI embedded processors. XDS110 connects to the target board through a TI 20-pin connector (with multiple adapters for TI 14-pin and Arm 10-pin and Arm 20-pin) and to the host PC through USB2.0 High Speed (480 Mbps). It supports a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. All XDS debug probes support Core and System Trace in all Arm and DSP processors that feature an Embedded Trace Buffer (ETB). For details,see XDS110 Debug Probe.

J-Link debug probes are the most popular choice for optimizing the debugging and flash programming experience. Benefit from record-breaking flash loaders, up to 3-MiB/s RAM download speed and the ability to set an unlimited number of breakpoints in the flash memory of MCUs. J-Link also supports a wide range of CPUs and architectures included Cortex M0+. For details, visit the Segger J-Link Debug Probes page.

Figure 2-3 shows a high-level diagram of the major functional areas and interfaces of the XDS110 probe to MSPM0 target.

MSPM0 Debugging Figure 2-3 MSPM0 Debugging