SLAU967 November   2025 MSPM0G5187

 

  1.   1
  2.   Description
  3.   Get Started
  4.   Features
  5.   Applications
  6.   6
  7. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  8. 2Hardware
    1. 2.1 Hardware Overview
    2. 2.2 Power Requirements
    3. 2.3 XDS110 Debug Probe
    4. 2.4 Measure Current Draw of the MSPM0G5187
    5. 2.5 Clocking
    6. 2.6 BoosterPack Plug-in Module Pinout
  9. 3Software
    1. 3.1 Software Development Options
    2. 3.2 Out-of-Box GUI
    3. 3.3 CCS Cloud
  10. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  11. 5Additional Information
    1. 5.1 Trademarks
  12. 6Related Documentation
    1. 6.1 Supplemental Content

4.2 PCB Layouts

LP-MSPM0G5187 Top Layer and Overlay (1st Layer)Figure 4-9 Top Layer and Overlay (1st Layer)
LP-MSPM0G5187 Ground Plane (3rd Layer)Figure 4-11 Ground Plane (3rd Layer)
LP-MSPM0G5187 VCC Plane (2nd Layer)Figure 4-10 VCC Plane (2nd Layer)
LP-MSPM0G5187 Bottom Layer and Overlay (4th Layer)Figure 4-12 Bottom Layer and Overlay (4th Layer)