As previously indicated, every type of Hall-effect device, will have some manufacturing variation and its performance will drift with temperature. These issues are captured by the minimum and maximum bounds found in the data sheet as shown in Table 2-2. At a minimum these bounds should be considered in the design and are incorporated into the calculator. Smaller differences between the minimum and maximum for BOP and BRP will lead to much tighter designs with less variation.
|DRV5033FA: ±3.5 / ±2 mT|
|BOP||Operate point||TA = –40°C to 125°C||±1.8||±3.5||±6.8||mT|
|Bhys||Hysteresis; Bhys = (BOP – BRP)||±1.5||mT|
|BO||Magnetic offset; BO = (BOP + BRP) / 2||±2.8||mT|
|DRV5033AJ: ±6.9 / ±3.5 mT|
|BOP||Operate point||TA = –40°C to 125°C||±3||±6.9||±12||mT|
|Bhys||Hysteresis; Bhys = (BOP – BRP)||3.4||mT|
|BO||Magnetic offset; BO = (BOP + BRP) / 2||5.2||mT|
Aside from BOP and BRP variation, die placement and more importantly Hall-element placement can have some variation. This variation is typically found in the data sheet in a figure similar to Figure 2-31 and is equivalent to an offset error.