SLUU359A April   2009  – February 2022 TPS51113

 

  1.   Trademarks
  2. 1 Introduction
  3. 2 Description
  4. 3 Typical Applications
  5. 4 Features
  6. 5 Electrical Performance Specifications
  7. 6 Schematic
  8. 7 Test Setup
    1. 7.1 Test Equipment
      1. 7.1.1 Voltage Source
      2. 7.1.2 Multimeters
      3. 7.1.3 Output Load
      4. 7.1.4 Oscilloscope
      5. 7.1.5 Fan
      6. 7.1.6 Recommended Wire Gauge
    2. 7.2 Recommended Test Setup
      1. 7.2.1 Input Connections
      2. 7.2.2 Output Connections
      3. 7.2.3 Other Connections
  9. 8 Test Procedure
    1. 8.1 Line/Load Regulation and Efficiency Measurement Procedure
    2. 8.2 Control Loop Gain and Phase Measurement Procedure
    3. 8.3 Test Points
    4. 8.4 Equipment Shutown Procedure
  10. 9 Performance Data and Typical Characteristic Curves
  11. 10EVM Assembly Drawing and PCB Layout
  12. 11List of Materials
  13. 12References
  14. 13Revision History

10 EVM Assembly Drawing and PCB Layout

Figure 10-1 through Figure 10-6 show the design of the TPS51113-EVM printed circuit board. The EVM has been designed using four layers on a 2-oz. copper circuit board.

GUID-00998F43-9F02-4118-9420-4F8DA6936DD6-low.gifFigure 10-1 Top Layer Assembly Drawing (Top View)
GUID-EA612DA0-FF78-403F-A904-69A266593999-low.gifFigure 10-3 Top Copper (Top View)
GUID-9FCC8D88-772B-430A-A4E3-398E77C6EFC8-low.gifFigure 10-5 Internal Layer 2 (Top View)
GUID-C444D431-5A10-44FE-A5E0-29B3D836FC24-low.gifFigure 10-2 Bottom Assembly Drawing (Bottom View)
GUID-01211B86-F99B-409C-B750-B54474283B78-low.gifFigure 10-4 Internal Layer 1 (Top View)
GUID-886FEE04-6953-44D5-8051-17D736967097-low.gifFigure 10-6 Bottom Copper (Top View)