As observed in the previous section, with a lower junction and case temperature, SOT23-6 package offers improved thermal performances over the SOT563. Although both packages use FCOL technology, SOT23-6 package leadframe design has a bigger copper area which reduces the parasitic impedance and allows more power dissipation, which translates into higher efficiency at heavy loads and improved thermal performances respectively.

On the other side, the SOT563 offer better efficiency at light loads. Also SOT563 (DRL) package is 65% smaller than the SOT23-6 (DDC), enabling much smaller design for space critical designs.