SLVAEU0 September   2020 LM117HVQML-SP , LM117QML-SP , LM136A-2.5QML-SP , LM137JAN-SP , LM137QML-SP , LM185-1.2QML-SP , LM185-2.5QML-SP , LM2940QML-SP , LM2941QML-SP , LM4050QML-SP , LM723JAN-SP , LP2953QML-SP , TL1431-SP , TPS50601-SP , TPS50601A-SP , TPS7A4501-SP , TPS7H1101-SP , TPS7H1101A-SP , TPS7H2201-SP , TPS7H2211-SP , TPS7H3301-SP , TPS7H4001-SP , TPS7H4002-SP , TPS7H5001-SP , TPS7H5002-SP , TPS7H5003-SP , TPS7H5004-SP , UC1525B-SP , UC1611-SP , UC1705-SP , UC1707-SP , UC1708-SP , UC1709-SP , UC1710-SP , UC1715-SP , UC1823A-SP , UC1825-SP , UC1825A-SP , UC1825B-SP , UC1832-SP , UC1834-SP , UC1842-SP , UC1842A-SP , UC1843-SP , UC1843A-SP , UC1843B-SP , UC1844-SP , UC1844A-SP , UC1845-SP , UC1845A-SP , UC1846-SP , UC1856-SP , UC1863-SP , UC1875-SP , UC1901-SP , UC19432-SP , UCC1806-SP

 

  1.   Trademarks
  2. 1Reflow Profiles
  3. 2Critical Considerations for Gold-Plated Termination-Finishes
  4. 3Considerations for Leadless Ceramic Chip Carrier Packages
  5. 4Lead Forming
  6. 5Ceramic Packaging
  7. 6References

Ceramic Packaging

The following table is a snapshot for reference purposes and may not be current. For package specific information and application notes, see http://www.ti.com/support-packaging/packaging-information.html.

Package Group

Description

Designator

CBGA

Ceramic Ball Grid Array

GJN,GLE,GLG,GLK,GNM

CCGA

Ceramic Column Grid Array

NAA,NWE

CDBGA

Ceramic Dimpled Ball Grid Array

GFP,GGP,GGR,GGZ,GHF,GHM,GJM,GKG,ZGR,

ZHM

CDIP

Ceramic Dual Inline Package

J,JG,JL,JNA,JNC,JND,JT,JTA,JTB,JTC,NAB,NAY,

NAZ,NFE

CDIP-BB

Ceramic Dual Inline Package – Bottom Braze

JDE,JDG

CDIP-SB

Ceramic Dual Inline Package – Side Braze

JC,JD,JDC,JDD,JDJ,JDK,JDM,JDN,JN,JVA,JVB,

JVD,JVE,JVF,NAK

CFCBGA

Ceramic Flip Chip Ball Grid Array

AAD,CDZ,CMA,CME,CMQ,CTF,CTJ,CTK,CUB,

CUD,CUM,CYC,GDZ,GLL,GLP,GMA,GME,

GTF,GTH,GTJ,GTK,GTQ,GUD,GUE,GUF,GUM,

ZDZ,ZUF

CFP

Ceramic Flat Pack

FAA,HAJ,HAY,HBC,HBD,HBE,HBU,HBY,HD,HE,HF,HFD,HFG,HFH,HFL,HFN,HFP,HFQ,

HFR,HFS,HG,HGA,HGF,HH,HKB,HKC,HKD,HKE,HKH,HKJ,HKK,HKN,HKP,HKQ,HKR,HKS,

HKT,HKU,HKV,HKW,HKX,HKY,HR,HT,HV,HY,

HZ,NAD,PHF,PHG,U,W,WA,WD,WH,WJ,WN

CFP

Ceramic Flat Pack - Gullwing Formed Leads

NAC

CLGA

Ceramic Land Grid Array

FVA, NAF,ZMA,ZMX

CPGA

Ceramic Pin Grid Array

GA,GB,GC,GE,GF,GFA,NAQ,NAR,NAT

CQFP

Ceramic Quad Flat Pack

NAU,NBA,NBB,NBC

CTO-92

Ceramic Transistor Outline 92

HTA

CZIP

Ceramic Zig-Zag Inline Package

SV

JLCC

J Lead Ceramic Chip Carrier

FJ,FZ,HJ,HJA

LCCC

Leadless Ceramic Chip Carrier

FD,FE,FFA,FFC,FFD,FFE,FFF,FFH,FFJ,FFK,FK,

FKH,FNC,FPH,FPM,FQ,HL,HM,NAJ

TO-CAN

Transistor Outline [Metal] Can

K,LMC,LMD,LME,LMF,LMG,NDS,NDT,NDU,

NDV,NEP,NEQ,NER