SLVAEX0 October   2020 TPS1H000-Q1 , TPS1H100-Q1 , TPS1H200A-Q1 , TPS1HA08-Q1 , TPS1HB16-Q1 , TPS1HB50-Q1 , TPS2HB16-Q1 , TPS2HB50-Q1 , TPS4H000-Q1 , TPS4H160-Q1

 

  1.   Abstract
  2.   Trademarks
  3. 1Introduction
  4. 2Normal Operation Diagnostics
    1. 2.1 Configuring Diagnostics With SEL/SELx Pin
      1. 2.1.1 Diagnostics Select Pin: SEL1
      2. 2.1.2 Diagnostics Select Pin: SELx
    2. 2.2 Operating Current Measurements Using the SNS/CS Pin
      1. 2.2.1 Internal/External Factor: Load Current Through Device
      2. 2.2.2 External Factor: Analog-to-Digital Converter (ADC)
      3. 2.2.3 External Factor: Probe Ground Termination
      4. 2.2.4 External Factor: Component Tolerances
    3. 2.3 Device Temperature on the Sense (SNS) Pin
  5. 3Fault State Diagnostics
    1. 3.1 Fault Behavior Configurations: Latch/THER/Delay Pin
      1. 3.1.1 Latch Pin
      2. 3.1.2 THER Pin
      3. 3.1.3 Delay Pin
    2. 3.2 Open Load Fault
    3. 3.3 Short to Battery Fault
    4. 3.4 Thermal Shutdown
    5. 3.5 Loss of Ground or Power Supply
    6. 3.6 Summary
  6. 4References

3.5 Loss of Ground or Power Supply

There are two types of loss of ground that TI’s smart high side switches protect from: Device GND and Module GND. In both cases, there is a mismatch of a ground reference for the device that causes the device to turn off the output. Loss of ground is not a fault that is reported on with diagnostics enabled because there is no way to; however, the device will protect itself.

In the case of a power supply loss, loads that are resistive or capacitors in nature, there are no concerns with the device protections that require external circuitry. Since inductive loads will reverse in polarity to maintain current when turned off, external circuitry such as a GND network and/or a free-wheeling circuit may be required. For more information, see Designing for Loss of Groudn and Loss of Battery on Texas Instruments High-Side Switches.