SLVUDK6A October   2025  – November 2025 TRF3302-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
      1. 3.2.1 PCB Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1.     Trademarks
  9. 5Revision History

3.2 PCB Layouts

Figure 3-4 through Figure 3-7 illustrate the PCB layers for this EVM.

TRF3302Q1EVM Top Layer Figure 3-4 Top Layer
TRF3302Q1EVM Layer 2 Figure 3-5 Layer 2
TRF3302Q1EVM Layer 3 Figure 3-6 Layer 3
TRF3302Q1EVM Bottom Layer Figure 3-7 Bottom Layer