SLVUDK6A October   2025  – November 2025 TRF3302-Q1

 

  1.   1
  2.   Description
  3.   Features
  4.   4
  5. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  6. 2Hardware
  7. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
      1. 3.2.1 PCB Stack-Up and Material
    3. 3.3 Bill of Materials (BOM)
  8. 4Additional Information
    1.     Trademarks
  9. 5Revision History

3.2.1 PCB Stack-Up and Material

The EVM board dimensions are 1300mil by 1070mil, thickness is 60.5mil, 4-layer board with material type Isola® 370HR as shown in Figure 3-8. The top layer routes the power, ground, and signals between SMA connectors and the device. Second layer is the reference RF ground layer. The signal trace impedance is targeted at nominal 50Ω. The bottom three layers are ground layers.

TRF3302Q1EVM EVM Stack-Up (Units in Mils)Figure 3-8 EVM Stack-Up (Units in Mils)