SPRADB3A October   2023  â€“ November 2024 AM2612 , AM2631 , AM2631-Q1 , AM2632 , AM2632-Q1 , AM2634 , AM2634-Q1 , AM263P2 , AM263P2-Q1 , AM263P4 , AM263P4-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 Feature Differences Between AM26x Devices
  5. 2 Package Options
  6. 3 Feature Differences Between AM263 and AM263P
    1. 3.1 Feature Differences for System Consideration
      1. 3.1.1 New Features in AM263P
        1. 3.1.1.1 Resolver Peripheral
          1. 3.1.1.1.1 Migration From Software to Hardware Resolver
        2. 3.1.1.2 Trigonometric Math Unit
        3. 3.1.1.3 Remote L2 Cache
      2. 3.1.2 Memory Subsystem Differences
      3. 3.1.3 CONTROLSS Module Differences
        1. 3.1.3.1 ADC Feature Differences and Additions
        2. 3.1.3.2 ADC Safety Tile Additions
        3. 3.1.3.3 ADC_R Module Addition
      4. 3.1.4 QSPI/OSPI Module Differences
      5. 3.1.5 Hardware Security Module Differences
      6. 3.1.6 Hardware Differences
        1. 3.1.6.1 Sourcing VPP With ANALDO
      7. 3.1.7 Feature Omissions in AM263P
  7. 4 Software Changes Between AM263 and AM263P SDK
  8. 5 Feature Differences Between AM263 and AM261 Devices
    1. 5.1 Feature Differences for System Consideration
      1. 5.1.1 New Features in AM261
        1. 5.1.1.1 Universal Serial Bus (USB)
        2. 5.1.1.2 Trigonometric Math Unit
        3. 5.1.1.3 Remote L2 Cache
      2. 5.1.2 Memory Subsystem Differences
      3. 5.1.3 CONTROLSS Module Differences
        1. 5.1.3.1 ADC Feature Differences and Additions
        2. 5.1.3.2 ADC Safety Tile Additions
      4. 5.1.4 CPSW Feature Additions
      5. 5.1.5 Hardware Differences
        1. 5.1.5.1 Sourcing VPP With ANALDO
      6. 5.1.6 Feature Reductions in AM261
  9. 6 Software Changes Between AM263 and AM261 SDK
  10. 7 Feature Differences Between AM263P and AM261 Devices
    1. 7.1 Feature Differences for System Consideration
      1. 7.1.1 New Features in AM261
        1. 7.1.1.1 General-Purpose Memory Controller (GPMC)
        2. 7.1.1.2 Universal Serial Bus (USB)
      2. 7.1.2 Memory Subsystem Differences
      3. 7.1.3 CPSW Feature Additions
      4. 7.1.4 ADC Module Differences
      5. 7.1.5 Feature Omissions and Reductions in AM261
  11. 8 Software Changes Between AM263P and AM261 SDK
  12. 9 List of Errata Fixes in AM26x Devices
  13. 10Revision History

1 Feature Differences Between AM26x Devices

Device Comparison provides a feature-level comparison between the AM26x superset devices: AM2634, AM263P4 and AM2612.

Table 1-1 Device Comparison
Features Reference
Name		 AM2634 AM263P4 AM2612
Processors and Accelerators
Arm Cortex-R5F R5FSS 4 4 2

Trigonometric Math Unit

 TMU No Yes Yes
Hardware Security Module HSM Yes Yes Yes
Crypto Accelerators Security Yes Yes Yes
Program and Data Storage
On-Chip Shared Memory (RAM) OCSRAM Grade N: 1 MB
Grade O/P: 2 MB		 Grade N: 2 MB
Grade O/P: 3 MB		 Grade M, N: 1MB
Grade L/O/P: 1.5MB
R5F Tightly Coupled Memory (TCM) TCM Up to 256KB(13) Up to 512kB(14) Up to 512kB
General-Purpose Memory Controller GPMC 4MB None None(7) or 4MB
Peripherals
Modular Controller Area Network Interface MCAN 4 8 2
Full CAN-FD Support MCAN 4 8 2
General-Purpose I/O GPIO Up to 139 Up to 140 Up to 141
Serial Peripheral Interface SPI 5 8 2(7) or 4
Universal Asynchronous Receiver and Transmitter UART 6 6 6
Local Interconnect Network LIN 5 5 3
Inter-Integrated Circuit Interface I2C 4

4

 3
Analog-to-Digital Converter ADC 3(1) or 5(2) 3(3) or 5(4) 2(7) or 3(10)
Resolver (ADC12B3M) RDC None 0(11) or 2(12) None
ADC None 0(11) or 2(12) None
Comparator Modules CMPSS 12(1) or 20(2) 12(3) or 20(4) 9
Digital-to-Analog Converter DAC 1 1 1
Programmable Real-Time Unit Subsystem(5) PRU-ICSS 0 or 1 0 or 1 2(9)
Industrial Communication Subsystem Support(6) PRU-ICSS Optional Optional Optional
Gigabit Ethernet Interface CPSW 2 1(12) or 2(11) 1
Multi-Media Card/Secure Digital Interface MMCSD 1 1 0(8) or 1
Enhanced High-Resolution Pulse-Width Modulator Module EHRPWM 16(1) or 32(2) 16(3) or 32(4) 10
Enhanced Capture Module ECAP 5(1) or 10(2) 8(3) or 16(4) 2
Enhanced Quadrature Encoder Pulse Module EQEP 2(1) or 3(2) 2(3) or 3(4) 2
Sigma Delta Filter Module SDFM 1(1) or 2(2) 1(3) or 2(4) 0(7) or 2
Fast Serial Interface FSI 4x FSI_RX + 4x FSI_TX 4x FSI_RX + 4x FSI_TX 1x FSI_RX + 1x FSI_TX
Quad / Octal SPI Flash Interface QSPI / OSPI QSPI OSPI(15) OSPI(15)

Real Time Interrupt

 RTI 4 8 4
Windowed Watchdog Timer WWDT 4 4 4
(1) Standard Analog configuration for AM263 contains 3x ADC, 16x EHRPWM, 5x eCAP, 2x EQEP, 1x SDFM, 12x CMPSS
(2) Enhanced Analog configuration for AM263 contains 5x ADC, 32x EHRPWM, 10x eCAP, 3x EQEP, 2x SDFM, 20x CMPSS
(3) Standard Analog configuration for AM263P contains 3x ADC, 16x EHRPWM, 8x eCAP, 2x EQEP, 1x SDFM, 12x CMPSS
(4) Enhanced Analog configuration for AM263P contains 5x ADC, 32x EHRPWM, 16x eCAP, 3x EQEP, 2x SDFM, 20x CMPSS
(5) AM263/AM263P: Programmable Real-Time Unit Subsystem is available when selecting an orderable part number that includes a feature code of D, E, F, K, L, M, or N. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.
(6) AM263/AM263P: Industrial Communication Subsystem Support is available when selecting an orderable part number that includes a feature code of D, E, F, K, L, M, or N. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.
(7) AM261 ZNC Package does not provide the General-Purpose Memory Controller (GPMC) and only provides 2 SPI, 2 ADC, and 0 SDFM peripheral instances. The SPI instances available are SPI0 and SPI2. The ADC instances available are ADC0 and ADC2.
(8) AM261 ZNC and ZEJ Packages do not provide the MMCSD peripheral.
(9) AM261 ZNC and ZEJ Packages have limitation in PRU-ICSS pin out which limits certain features. Refer to the Device Data sheet for a PRU-ICSS GPIO Signal Descriptions table for a list of pins available and not available per package.
(10) AM261 ZCZ Package only offers six ADC channels per instance of the ADC peripheral for a total of 18 channels. All other package variants offer seven ADC channels per instance for a total of 14 or 21 channels.
(11) AM263P: Applies to devices in the ZCZ-C Package only and have a Special Features code of C. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.
(12) AM263P: Applies to devices in the ZCZ-S Package only and have a Special Features code of F or S. Refer to the Device Data sheet for a Nomenclature Description table for definition of all feature codes.
(13) Each R5FSS cluster supports 128-KB of Tightly-Coupled Memory (TCM). When configured as Single-Core or Lockstep operating mode, individual cores can utilize the entire 128-KB of TCM memory, while in Dual-Core mode, each core can only utilize the designated half (64-KB TCM).
(14) Each R5FSS cluster supports 256-KB of Tightly-Coupled Memory (TCM). When configured as Single-Core or Lockstep operating mode, individual cores can utilize the entire 256-KB of TCM memory, while in Dual-Core mode, each core can only utilize the designated half (128-KB TCM).
(15) AM263P/AM261: The Octal SPI (OSPI) Flash Interface can support Quad SPI (QSPI) Flash devices. The differences between QSPI and OSPI are covered in Section 3.1.4.