SPRZ342O January   2011  – April 2021 TMS320F28062 , TMS320F28062-Q1 , TMS320F28062F , TMS320F28062F-Q1 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28066-Q1 , TMS320F28067 , TMS320F28067-Q1 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069-Q1 , TMS320F28069F , TMS320F28069F-Q1 , TMS320F28069M , TMS320F28069M-Q1

 

  1.   Abstract
  2. 1Usage Notes and Advisories Matrices
    1. 1.1 Usage Notes Matrix
    2. 1.2 Advisories Matrix
  3. 2Nomenclature, Package Symbolization, and Revision Identification
    1. 2.1 Device and Development Support Tool Nomenclature
    2. 2.2 Devices Supported
    3. 2.3 Package Symbolization and Revision Identification
  4. 3Silicon Revision B Usage Notes and Advisories
    1. 3.1 Silicon Revision B Usage Notes
      1. 3.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear
      2. 3.1.2 CAN Bootloader: Internal Oscillator Tolerance is Not Sufficient for CAN Operation at High Temperatures
      3. 3.1.3 FPU32 and VCU Back-to-Back Memory Accesses
      4. 3.1.4 Caution While Using Nested Interrupts
      5. 3.1.5 Flash: MAX "Program Time” and “Erase Time” in Revision G of the TMS320F2806x Piccolo™ Microcontrollers Data Manual are only Applicable for Devices Manufactured After January 2018
    2. 3.2 Silicon Revision B Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17.      Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22.      Advisory
      23.      Advisory
      24.      Advisory
      25.      Advisory
      26.      Advisory
      27.      Advisory
  5. 4Silicon Revision A Usage Notes and Advisories
    1. 4.1 Silicon Revision A Usage Notes
    2. 4.2 Silicon Revision A Advisories
  6. 5Silicon Revision 0 Usage Notes and Advisories
    1. 5.1 Silicon Revision 0 Usage Notes
    2. 5.2 Silicon Revision 0 Advisories
      1.      Advisory
      2.      Advisory
      3.      Advisory
  7. 6Documentation Support
  8. 7Trademarks
  9. 8Revision History

3.1.2 CAN Bootloader: Internal Oscillator Tolerance is Not Sufficient for CAN Operation at High Temperatures

Revision(s) Affected: 0, A, B

The CAN bootloader in the device's boot ROM uses the internal oscillator as the source for the CAN bit clock. At high temperatures, the frequency of the internal oscillator can deviate enough to prevent messages from being received.

Workaround: Recalibrate the internal oscillator before invoking the CAN bootloader. This can be done in application code. For more flexibility, a wrapper function may be programmed into the device's OTP memory. See Using the Piccolo™ CAN Bootloader at High Temperature for details on how to implement this workaround.