TIDUEZ3A April   2021  – June 2022

 

  1.   Description
  2.   Resources
  3.   Features
  4.   Applications
  5.   5
  6. 1System Description
  7. 2System Overview
    1. 2.1 Block Diagram
    2. 2.2 Design Considerations
    3. 2.3 Highlighted Products
      1. 2.3.1 LMG342xR030
      2. 2.3.2 TMS320F28002x
      3. 2.3.3 OPA607
      4. 2.3.4 UCC21222
  8. 3Hardware, Testing Requirements, and Test Results
    1. 3.1 Hardware Requirements
    2. 3.2 Test Setup
    3. 3.3 Test Results
      1. 3.3.1 Test Procedures
      2. 3.3.2 Performance Data: Efficiency, iTHD, and Power Factor
      3. 3.3.3 Functional Waveforms
        1. 3.3.3.1 Current Sensing and Protection
        2. 3.3.3.2 Power Stage Startup and Input Waveforms
        3. 3.3.3.3 AC Drop Test
        4. 3.3.3.4 Surge Test
        5. 3.3.3.5 EMI Test
      4. 3.3.4 Thermal Test
      5. 3.3.5 GaN FET Switching Waveform
  9. 4Design and Documentation Support
    1. 4.1 Design Files
      1. 4.1.1 Schematics
      2. 4.1.2 BOM
    2. 4.2 Documentation Support
    3. 4.3 Support Resources
    4. 4.4 Trademarks
  10. 5About the Author
  11. 6Revision History

Thermal Test

Thermal performance is validated in this design. The test conditions are the following:

  • 200 VAC with 4-kW load
  • Cooling FAN: 27CFM, 24 V 2.64 W
  • Thermal balanced after 10 minutes

Figure 3-20 illustrates the test results.


GUID-20210309-CA0I-HH6C-TD67-C90CRB2V3X3X-low.jpg

Figure 3-20 Thermal Performance Test