SWRS177B February   2015  – July 2016 CC2630

PRODUCTION DATA.  

  1. 1Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Functional Block Diagram
  2. 2Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagram - RGZ Package
    2. 4.2 Signal Descriptions - RGZ Package
    3. 4.3 Pin Diagram - RHB Package
    4. 4.4 Signal Descriptions - RHB Package
    5. 4.5 Pin Diagram - RSM Package
    6. 4.6 Signal Descriptions - RSM Package
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Power Consumption Summary
    5. 5.5  General Characteristics
    6. 5.6  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - RX
    7. 5.7  IEEE 802.15.4 (Offset Q-PSK DSSS, 250 kbps) - TX
    8. 5.8  24-MHz Crystal Oscillator (XOSC_HF)
    9. 5.9  32.768-kHz Crystal Oscillator (XOSC_LF)
    10. 5.10 48-MHz RC Oscillator (RCOSC_HF)
    11. 5.11 32-kHz RC Oscillator (RCOSC_LF)
    12. 5.12 ADC Characteristics
    13. 5.13 Temperature Sensor
    14. 5.14 Battery Monitor
    15. 5.15 Continuous Time Comparator
    16. 5.16 Low-Power Clocked Comparator
    17. 5.17 Programmable Current Source
    18. 5.18 Synchronous Serial Interface (SSI)
    19. 5.19 DC Characteristics
    20. 5.20 Thermal Resistance Characteristics
    21. 5.21 Timing Requirements
    22. 5.22 Switching Characteristics
    23. 5.23 Typical Characteristics
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagram
    3. 6.3  Main CPU
    4. 6.4  RF Core
    5. 6.5  Sensor Controller
    6. 6.6  Memory
    7. 6.7  Debug
    8. 6.8  Power Management
    9. 6.9  Clock Systems
    10. 6.10 General Peripherals and Modules
    11. 6.11 Voltage Supply Domains
    12. 6.12 System Architecture
  7. 7Application, Implementation, and Layout
    1. 7.1 Application Information
    2. 7.2 5 × 5 External Differential (5XD) Application Circuit
      1. 7.2.1 Layout
    3. 7.3 4 × 4 External Single-ended (4XS) Application Circuit
      1. 7.3.1 Layout
  8. 8Device and Documentation Support
    1. 8.1  Device Nomenclature
    2. 8.2  Tools and Software
    3. 8.3  Documentation Support
    4. 8.4  Texas Instruments Low-Power RF Website
    5. 8.5  Low-Power RF eNewsletter
    6. 8.6  Community Resources
    7. 8.7  Additional Information
    8. 8.8  Trademarks
    9. 8.9  Electrostatic Discharge Caution
    10. 8.10 Export Control Notice
    11. 8.11 Glossary
  9. 9Mechanical Packaging and Orderable Information
    1. 9.1 Packaging Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RSM|32
  • RHB|32
  • RGZ|48
サーマルパッド・メカニカル・データ
発注情報

1 Device Overview

1.1 Features

  • Microcontroller
    • Powerful ARM® Cortex®-M3
    • EEMBC CoreMark® Score: 142
    • Up to 48-MHz Clock Speed
    • 128KB of In-System Programmable Flash
    • 8KB of SRAM for Cache
    • 20KB of Ultralow-Leakage SRAM
    • 2-Pin cJTAG and JTAG Debugging
    • Supports Over-The-Air Upgrade (OTA)
  • Ultralow-Power Sensor Controller
    • Can Run Autonomous From the Rest of the System
    • 16-Bit Architecture
    • 2KB of Ultralow-Leakage SRAM for Code and Data
  • Efficient Code Size Architecture, Placing Drivers, IEEE 802.15.4 MAC, and Bootloader in ROM
  • RoHS-Compliant Packages
    • 4-mm × 4-mm RSM VQFN32 (10 GPIOs)
    • 5-mm × 5-mm RHB VQFN32 (15 GPIOs)
    • 7-mm × 7-mm RGZ VQFN48 (31 GPIOs)
  • Peripherals
    • All Digital Peripheral Pins Can Be Routed to Any GPIO
    • Four General-Purpose Timer Modules
      (Eight 16-Bit or Four 32-Bit Timers, PWM Each)
    • 12-Bit ADC, 200-ksamples/s, 8-Channel Analog MUX
    • Continuous Time Comparator
    • Ultralow-Power Analog Comparator
    • Programmable Current Source
    • UART
    • 2× SSI (SPI, MICROWIRE, TI)
    • I2C
    • I2S
    • Real-Time Clock (RTC)
    • AES-128 Security Module
    • True Random Number Generator (TRNG)
    • 10, 15, or 31 GPIOs, Depending on Package Option
    • Support for Eight Capacitive-Sensing Buttons
    • Integrated Temperature Sensor
  • External System
    • On-Chip internal DC-DC Converter
    • Very Few External Components
    • Seamless Integration With the SimpleLink™ CC2590 and CC2592 Range Extenders
    • Pin Compatible With the SimpleLink CC13xx in 4-mm × 4-mm and 5-mm × 5-mm VQFN Packages
  • Low Power
    • Wide Supply Voltage Range
      • Normal Operation: 1.8 to 3.8 V
      • External Regulator Mode: 1.7 to 1.95 V
    • Active-Mode RX: 5.9 mA
    • Active-Mode TX at 0 dBm: 6.1 mA
    • Active-Mode TX at +5 dBm: 9.1 mA
    • Active-Mode MCU: 61 µA/MHz
    • Active-Mode MCU: 48.5 CoreMark/mA
    • Active-Mode Sensor Controller: 8.2 µA/MHz
    • Standby: 1 µA (RTC Running and RAM/CPU Retention)
    • Shutdown: 100 nA (Wake Up on External Events)
  • RF Section
    • 2.4-GHz RF Transceiver Compatible With IEEE 802.15.4 PHY and MAC
    • Excellent Receiver Sensitivity (–100 dBm), Selectivity, and Blocking Performance
    • Link budget of 105 dB
    • Programmable Output Power up to +5 dBm
    • Single-Ended or Differential RF Interface
    • Suitable for Systems Targeting Compliance With Worldwide Radio Frequency Regulations
      • ETSI EN 300 328 (Europe)
      • EN 300 440 Class 2 (Europe)
      • FCC CFR47 Part 15 (US)
      • ARIB STD-T66 (Japan)
  • Tools and Development Environment
    • Full-Feature and Low-Cost Development Kits
    • Multiple Reference Designs for Different RF Configurations
    • Packet Sniffer PC Software
    • Sensor Controller Studio
    • SmartRF™ Studio
    • SmartRF Flash Programmer 2
    • IAR Embedded Workbench® for ARM
    • Code Composer Studio™

1.2 Applications

  • Home and Building Automation
  • Lighting Control
  • Alarm and Security
  • Electronic Shelf Labeling
  • Proximity Tags
  • Wireless Sensor Networks
  • Energy Harvesting, Batteryless Sensors, and Actuators
  • Smart Grid

1.3 Description

The CC2630 device is a wireless MCU targeting ZigBee® and 6LoWPAN applications.

The device is a member of the CC26xx family of cost-effective, ultralow power, 2.4-GHz RF devices. Very low active RF and MCU current and low-power mode current consumption provide excellent battery lifetime and allow for operation on small coin cell batteries and in energy-harvesting applications.

The CC2630 device contains a 32-bit ARM Cortex-M3 processor that runs at 48 MHz as the main processor and a rich peripheral feature set that includes a unique ultralow power sensor controller. This sensor controller is ideal for interfacing external sensors and for collecting analog and digital data autonomously while the rest of the system is in sleep mode. Thus, the CC2630 device is ideal for battery-powered and energy harvesting end nodes in ZigBee and 6LoWPAN networks.

The IEEE 802.15.4 MAC is embedded into ROM and runs partly on an ARM Cortex-M0 processor. This architecture improves overall system performance and power consumption and frees up flash memory for the application.

The ZigBee stack is available free of charge from www.ti.com.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
CC2630F128RGZ VQFN (48) 7.00 mm × 7.00 mm
CC2630F128RHB VQFN (32) 5.00 mm × 5.00 mm
CC2630F128RSM VQFN (32) 4.00 mm × 4.00 mm
(1) For more information, see Section 9, Mechanical Packaging and Orderable Information.

1.3.1 Functional Block Diagram

Figure 1-1 shows a block diagram for the CC2630.

CC2630 CC26xx_Block_Diagram_LPRF_2_9_15.gif Figure 1-1 Block Diagram