This application report helps in the thermal design aspect of TI Antenna on package mmWave sensor products. In this document, you will navigate a series of tasks and key care abouts of thermal design aspects such as PCB design, thermal mitigation techniques involving trade-offs on board size, heat sink, power dissipation and use-case scenarios taking TI Antenna on package EVM as a reference. This document discusses design practices that ensure better thermal management, including some common methods for dissipating the heat from a PCB.