SWRB036B May   2017  – February 2022 CC2564C

 

  1. 1Application Brief

1 Application Brief

Overview

The TI dual-mode CC2564C solution is a complete Bluetooth® BR/EDR/LE HCI or Bluetooth + Bluetooth low energy solution that reduces design effort and enables fast time to market.

A royalty-free software Bluetooth stack, available from TI, is pre-integrated with a variety of platforms including TI’s MSP432™ Arm® Cortex®-M4 core MCUs and Linux® Sitara™ MPUs. The stack is also available for MFi solutions and non-TI MCUs. Examples of profiles supported today include: Serial Port Profile (SPP), Human Interface Device (HID), Advanced Audio Distribution Profile (A2DP), Audio/ Video Remote Control Profile (AVRCP), Health Device Profile (HDP) and several Bluetooth low energy profiles (vary based on the supported MCU).

CC2564C and the TI software stack provide a fully certified Bluetooth 4.2 solution (5.1 compliant), including:

  • LE Secure connections: Bluetooth 4.2 security algorithm (ECDH) for key generation and new pairing procedure for key exchange
  • Link Layer topology: Bluetooth 4.1 scatternet capabilities, managing connection in a dual-mode topology allowing sensor network topology
GUID-20220224-SS0I-FKZL-QB01-TJGZFDL3R7PK-low.png Figure 1-1 CC2564C Block Diagram

Key Features

  • Single-chip Bluetooth solution integrating Bluetooth Basic Rate (BR)/Enhanced Data Rate (EDR), low energy (LE) features fully compliant with the Bluetooth 4.2 specification up to the HCI layer
  • BR/EDR features include assisted mode to reduce host processing and power:
    • HFP1.6 wideband speech (WBS) profile including CSA2 spec commands
    • A2DP profile including SBC encoding/decoding
  • LE supports up to 10 simultaneous connections
  • LE capabilities of dual-mode link layer topology scatternet: can act concurrently as central and peripheral
  • Enhanced audio time synchronization, supporting multi-speakers functionality
  • Flexibility for easy stack integration and validation into various microcontrollers, such as MSP432, Arm Cortex-M4 MCUs and Sitara MPUs
  • Highly optimized for low-cost designs:
    • Package footprint: 76 pins, 0.6-mm pitch, 8.10-mm × 8.10-mm mrQFN
  • Best-in-class Bluetooth (RF) performance (TX power, RX sensitivity, blocking)
    • Class 1.5 TX power up to +12 dBm
    • Provides longer range, including 2× range over Bluetooth low energy-only solutions
  • Advanced power management for extended battery life and ease of design
  • Physical interfaces:
    • Standard HCI over H4 UART (4 wire)
    • Standard HCI over H5 UART (2 wire)
    • Fully programmable digital PCM-I2S codec interface
  • –40°C to +85°C temperature range

Benefits

  • Best-in-class link budget extends application range
  • Simplified hardware and software development
  • Reduced development time and costs
  • Enables simultaneous operations of Bluetooth with Bluetooth low energy

Applications

  • Wireless audio solutions
  • Point of Sale (POS) and mPOS
  • Medical devices
  • Set-top boxes (STBs)
  • Wearable devices
  • Sensor hub, Sensor gateway
  • Home and factory automation

Development Tools and Software

Product Number Description Availability
CC256xCQFN-EMGUID-20220224-SS0I-HT5R-3DQ6-XDRHGQL9KFGK-low.png CC256xCBluetooth / dual-mode QFN device evaluation module TI store and authorized distributors