SBAS917C August   2019  – May 2025 AMC3301

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics
    10. 5.10 Switching Characteristics
    11. 5.11 Timing Diagram
    12. 5.12 Insulation Characteristics Curves
    13. 5.13 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
      2. 6.3.2 Data Isolation Channel Signal Transmission
      3. 6.3.3 Analog Output
      4. 6.3.4 Isolated DC/DC Converter
      5. 6.3.5 Diagnostic Output
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Shunt Resistor Sizing
        2. 7.2.2.2 Input Filter Design
        3. 7.2.2.3 Differential to Single-Ended Output Conversion
      3. 7.2.3 Application Curve
    3. 7.3 Best Design Practices
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

4 Pin Configuration and Functions

AMC3301 DWE Package,16-Pin SOIC,Top View Figure 4-1 DWE Package,16-Pin SOIC,Top View
Table 4-1 Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 DCDC_OUT Power High-side output of the isolated DC/DC converter; connect this pin to the HLDO_IN pin.(1)
2 DCDC_HGND High-side power ground High-side ground reference for the isolated DC/DC converter; connect this pin to the HGND pin.
3 HLDO_IN Power Input of the high-side LDO; connect this pin to the DCDC_OUT pin.(1)
4 NC — No internal connection; connect this pin to HGND or leave this pin unconnected.
5 HLDO_OUT Power Output of the high-side LDO.(1)
6 INP Analog input Noninverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
7 INN Analog input Inverting analog input. Either INP or INN must have a DC current path to HGND to define the common-mode input voltage.(2)
8 HGND High-side signal ground High-side analog ground; connect this pin to the DCDC_HGND pin.
9 GND Low-side signal ground Low-side analog ground; connect this pin to the DCDC_GND pin.
10 OUTN Analog output Inverting analog output.
11 OUTP Analog output Noninverting analog output.
12 VDD Low-side power Low-side power supply.(1)
13 LDO_OUT Power Output of the low-side LDO; connect this pin to the DCDC_IN pin. The output of the LDO must not be loaded by external circuitry.(1)
14 DIAG Digital output Active-low, open-drain status indicator output; connect this pin to the pullup supply (for example, VDD) using a resistor or leave this pin floating if not used.
15 DCDC_GND Low-side power ground Low-side ground reference for the isolated DC/DC converter; connect this pin to the GND pin.
16 DCDC_IN Power Low-side input of the isolated DC/DC converter; connect this pin to the LDO_OUT pin.(1)
(1) See the Power Supply Recommendations section for power-supply decoupling recommendations.
(2) See the Layout section for details.