SBOS622D July   2018  – May 2025 OPA855

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input and ESD Protection
      2. 8.3.2 Feedback Pin
      3. 8.3.3 Wide Gain-Bandwidth Product
      4. 8.3.4 Slew Rate and Output Stage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply and Single-Supply Operation
      2. 8.4.2 Power-Down Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TIA in an Optical Front-End System
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Optical Sensor Interface
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

11 Revision History

Changes from Revision C (January 2023) to Revision D (May 2025)

  • Changed bare die status from preview to production data (active)Go

Changes from Revision B (January 2022) to Revision C (January 2023)

  • Added the Typical Application, Design Requirements, Detailed Design Procedure, and Application Curves sectionsGo

Changes from Revision A (October 2018) to Revision B (January 2022)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added bare die preview package to the Features section and Device Information tableGo
  • Added the bare die preview package to the Pin Configuration and Functions sectionGo

Changes from Revision * (July 2018) to Revision A (October 2018)

  • Changed from Advance Information to Production Data (active)Go