SCAS530E August   1995  – April 2025 SN74ACT32

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Description
  4. 3 Pin Configuration and Functions
  5. 4 Specifications
    1. 4.1 Absolute Maximum Ratings
    2. 4.2 Recommended Operating Conditions
    3. 4.3 Thermal Information
    4. 4.4 Electrical Characteristics
    5. 4.5 Switching Characteristics
    6. 4.6 Operating Characteristics
  6. 5 Parameter Measurement Information
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support (Analog)
      1. 8.1.1 Related Links
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

3 Pin Configuration and Functions

SN74ACT32 D, DB, N, NS, or PW Package, 14-Pin SOIC, SSOP, PDIP, SOP, or TSSOP (Top View) Figure 3-1 D, DB, N, NS, or PW Package,
14-Pin SOIC, SSOP, PDIP, SOP, or TSSOP (Top View)
SN74ACT32 BQA Package, 14-Pin WQFN (Top View) Figure 3-2 BQA Package, 14-Pin WQFN (Top View)
Table 3-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME SN74ACT32
BQA, D, DB, DGV, N, NS, PW, RGY, BQA
1A

1

 I 1A Input
1B

2

 I 1B Input
1Y

3

 O 1Y Output
2A

4

 I 2A Input
2B

5

 I 2B Input
2Y

6

 O 2Y Output
3A

9

 I 3A Input
3B

10

 I 3B Input
3Y

8

 O 3Y Output
4A 12 I 4A Input
4B 13 I 4B Input
4Y 11 O 4Y Output
GND 7 — Ground Pin
NC — — No Connection
VCC 14 — Power Pin
Thermal Pad(2) — The thermal pad can be connected to GND or left floating. Do not connect to any other signal or supply.
(1) Signal Types: I = Input, O = Output, I/O = Input or Output.
(2) BQA Package only