SDAA059 September   2025 TMCS1123 , TMCS1123-Q1 , TMCS1126 , TMCS1126-Q1 , TMCS1127 , TMCS1127-Q1 , TMCS1133 , TMCS1133-Q1 , TMCS1143 , TMCS1148

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Exposure of the SOIC-10 to Board Level Reliability Testing
    1. 2.1 Examination of Solder Joints Through X-ray
    2. 2.2 Thermal Testing
    3. 2.3 Cross Sections
  6. 3Summary
  7. 4References

3 Summary

Correct selection of solder paste is required when using larger pads for the mitigation of solder voiding in larger solder joints. In general, a no-clean solder paste is a preferred option to optimize these joints for best performance.

In general, there are little to no risks in the use of an SOIC-10 package on an SOIC-16 footprint. Across all examinations, there is little to no observed change in device thermal performance, PCB substrate integrity, or device leadframe integrity after 1000 hours of continuous temperature stress.