SDYU001AC June   2015  – November 2025 LSF0101 , LSF0102 , LSF0108 , SN74GTL2014 , SN74HC245 , SN74LS07 , SN74LV123A , SN74LV1T08 , SN74LV1T34 , SN74LV244AT , SN74LV245A , SN74LV4T125 , SN74LVC14A , SN74LVC1G08 , SN74LVC1G125 , SN74LVC245A , SN74LVTH125 , SN74LVTH16244A , SN74LVTH16245A , SN74LVTH245A

 

  1.   1
  2.   Trademarks
  3. 1Introduction
  4. 2Logic Overview
    1. 2.1 Logic Family Quick Reference
    2. 2.2 Comparison of Switching Standards
    3. 2.3 Automotive Logic
    4. 2.4 Ongoing Packaging Investment
    5. 2.5 TI's Programmable Logic Devices: TPLD
    6. 2.6 Function Table
  5. 3Logic Families
    1. 3.1  Legacy Logic
    2. 3.2  AC(T): Advanced CMOS
    3. 3.3  AHC(T): Advanced High-Speed CMOS
    4. 3.4  ALVC: Advanced Low-Voltage CMOS
    5. 3.5  AUC: Advanced Ultra Low Voltage CMOS
    6. 3.6  AUP: Advanced Ultra-Low Power
    7. 3.7  AVC: Advanced Very-Low-Voltage CMOS
    8. 3.8  HC(T): High-Speed CMOS
    9. 3.9  HCS: High-Speed CMOS with Schmitt-trigger inputs
    10. 3.10 LV-A(T): Low Voltage
    11. 3.11 LVxT: Low-Voltage CMOS Single Supply Translating Logic
    12. 3.12 LVC: Low-Voltage CMOS
    13. 3.13 LVT: Low-Voltage BiCMOS Technology
  6. 4Appendix A: Logic Packages
  7. 5Appendix B: Competitor Family Cross Reference
  8. 6Appendix C: Logic Part Number Naming Conventions
  9. 7Appendix D: Standard Logic Functions
  10. 8Revision History

4 Appendix A: Logic Packages

Note: Pictures are not to scale

Table 4-1 5-8 Pin Packages
Pin Count 5 6 8
X2SON

Pitch: 0.48 mm, 0.35 mm

0.8 × 0.8 mm (0.48 mm)

DPW 5 DPW 5

1.0 × 1.0 mm (0.35 mm)

DSF 6 DSF 6

1.4 × 1.0 mm (0.35 mm)

DQE 8 DQE 8
VSSOP

Pitch: 0.5 mm

2.3 × 2.0 mm

DCU 8 DCU 8
SOT-5X3

Pitch: 0.5 mm

1.6 × 1.2 mm

DRL 5 DRL 5

1.6 × 1.2 mm

DRL 6 DRL 6
USON

Pitch: 0.5 mm

1.45 × 1.0 mm

DRY 6 DRY 6
SOT-SC70

Pitch: 0.65 mm

2.0 mm × 1.25 mm

DCK 5 DCK 5

2.0 mm × 1.25 mm

DCK 6 DCK 6
SSOP

Pitch: 0.65 mm

2.95 × 2.8 mm

DCT 8 DCT 8
SOT-23

Pitch: 0.95 mm

2.9 × 1.6 mm

DBV 5 DBV 5

2.9 × 1.6 mm

DBV 6 DBV 6
Table 4-2 14-24 Pin Packages
Pin Count 14 16 20 24
TVSOP

Pitch: 0.4 mm

 3.6 × 4.4 mm
DGV 14 DGV 14
 3.6 × 4.4 mm
DGV 16 DGV 16
 5.0 × 4.4 mm
DGV 20 DGV 20
 5.0 × 4.4 mm
DGV 24 DGV 24
UQFN

Pitch: 0.4 mm

 2.6 × 1.8 mm
RSV 16 RSV 16
VSSOP

Pitch: 0.5 mm

 8.1 × 3.0 mm
DGS 20 DGS 20
SOT-23-THN

Pitch: 0.5 mm

 4.2 × 2.0 mm
DYY 14 DYY 14
 4.2 × 2.0 mm
DYY 16 DYY 16
WQFN

Pitch: 0.5 mm
BQA 14 BQA 14
3.0 × 2.5 mm
BQB 16 BQB 16
3.0 × 2.5 mm
VQFN

Pitch: 0.5 mm

 3.5 × 3.5 mm
RGY 14 RGY 14
 4.0 × 3.5 mm
RGY 16 RGY 16
 4.5 × 3.5 mm
RGY 20 RGY 20
4.5 × 2.5 mm
RKS 20 RKS 20
 5.5 × 3.5 mm
RGY 24 RGY 24
5.5 × 3.5 mm
RHL 24 RHL 24
SSOP

Pitch: 0.65 mm

 6.2 × 5.3 mm
DB 14 DB 14
 6.2 × 5.3 mm
DB 16 DB 16
 7.2 × 5.3 mm
DB 20 DB 20
 8.2 × 5.3 mm
DB 24 DB 24
TSSOP

Pitch: 0.65 mm
PW 14 PW 14
5.0 × 4.4 mm
PW 16 PW 16
5.0 × 4.4 mm
PW 20 PW 20
6.5 × 4.4 mm
PW 24 PW 24
7.8 × 4.4 mm
SOIC

Pitch: 1.27 mm

8.65 × 3.91 mm

D 14 D 14

9.9 × 3.91 mm

D 16 D 16

10.3 × 7.5 mm

DW 16 DW 16

12.8 × 7.5 mm

DW 20 DW 20

15.4 × 7.5 mm

DW 24 DW 24
SOP

Pitch: 1.27 mm

 10.3 × 5.3 mm
NS 14 NS 14

10.3 × 5.3 mm

NS 16 NS 16
 12.6 × 5.3 mm
NS 20 NS 20

15.0 × 5.3 mm

NS 24 NS 24