SFFS924A August   2024  – February 2025 SN74LV4051A-Q1 , SN74LV4052A-Q1 , SN74LV4053A-Q1

 

  1.   1
  2.   Trademarks
  3. 1Overview
  4. 2Functional Safety Failure In Time (FIT) Rates
    1. 2.1 TSSOP Package
    2. 2.2 SOIC Package
    3. 2.3 SOT-23-THIN Package
  5. 3Failure Mode Distribution (FMD)
  6. 4Pin Failure Mode Analysis (Pin FMA)
    1. 4.1 SN74LV4051A-Q1: TSSOP, SOIC, and SOT-23-THIN Packages
    2. 4.2 SN74LV4052A-Q1: TSSOP and SOT-23-THIN Packages
    3. 4.3 SN74LV4053A-Q1: TSSOP and SOT-23-THIN Packages
  7. 5Revision History

Pin Failure Mode Analysis (Pin FMA)

This section provides a failure mode analysis (FMA) for the pins of the SN74LV405xA-Q1. The failure modes covered in this document include the typical pin-by-pin failure scenarios:

Table 4-2 through Table 4-13 also indicate how these pin conditions can affect the device as per the failure effects classification in Table 4-1.

Table 4-1 TI Classification of Failure Effects
ClassFailure Effects
APotential device damage that affects functionality.
BNo device damage, but loss of functionality.
CNo device damage, but performance degradation.
DNo device damage, no impact to functionality or performance.