SGLS274H September   2008  – October 2016 UCC27423-Q1 , UCC27424-Q1 , UCC27425-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Stage
      2. 8.3.2 Output Stage
      3. 8.3.3 Enable
      4. 8.3.4 Parallel Outputs
      5. 8.3.5 Operational Waveforms and Circuit Layout
      6. 8.3.6 VDD
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Source and Sink Capabilities During Miller Plateau
        2. 9.2.2.2 Drive Current and Power Requirements
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from G Revision (May 2016) to H Revision

  • Changed the UCC27424-Q1 pinout drawing to show two, noninverting channelsGo
  • Changed the units of the capacitors in the Parallel Outputs figure from mF to µFGo
  • Added the Receiving Notification of Documentation Updates sectionGo

Changes from F Revision (September 2012) to G Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Added MSOP package information to Features and Description sections Go

Changes from E Revision (July, 2012) to F Revision

  • Changed the word terminal to pin per new standardsGo
  • Removed derating factor column in dissipation ratings table, and changed the θJC value from 4.7 to 11.9, the θJA value from 50–59 to 63, and the power rating TA = 70°C (mW) value from 1370 to 873 for the DGN package. Go